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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Keränen, Kimmo
VTT Technical Research Centre of Finland
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2020The Effect of Torsional Bending on Reliability and Lifetime of Printed Silver Conductorscitations
- 2019Wireless Powering for Glass-Laminated Functionalities
- 2012Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanescitations
- 2012Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanescitations
- 2012Printed hybrid systemscitations
- 2012Hot laminated multilayer polymer illumination structure based in embedded LED chipscitations
- 2010Differential photoacoustic gas cell based on LTCC for ppm gas sensingcitations
- 2009Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substratecitations
- 2008Photonic module integration based on silicon, ceramic and plastic technologies
- 2007The studies of the illumination/detection module in Integrated Microinterferometric Extensometer
- 2007Inmould integration of a microscope add-on system to a 1.3 Mpix camera phonecitations
- 2006Fiber pigtailed multimode laser module based on passive device alignment on an LTCC substratecitations
- 2006Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate
- 2002Fiberoptic in-vessel viewing system for the international thermonuclear experimental reactorcitations
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document
Differential photoacoustic gas cell based on LTCC for ppm gas sensing
Abstract
Silicon MEMS cantilever-based photoacoustic technology allows for the sensing of ultra low gas concentrations with very wide dynamic range. The sensitivity enhancement is achieved with a cantilever microphone system in which the cantilever displacement is probed with an optical interferometer providing a pico-meter resolution. In the gas sensor, the silicon cantilever microphone is placed in a two-chamber differential gas cell. By monitoring differential pressure changes between the two chambers, the differential cell operates as a differential infra-red detector for optical absorption signals through a measurement and reference path. The differential pressure signal is proportional to gas concentration in the optical measurement path. We have designed, implemented and tested a differential photo-acoustic gas cell based on Low Temperature Co-fired Ceramic (LTCC) multilayer substrate technology. Standard LTCC technology enables implementation of 2.5D structures including holes, cavities and channels into the electronic substrate. The implemented differential photoacoustic gas cell structure includes two 10 mm long cylindrical cells, diameter of 2.4 mm. Reflectance measurements of the cell showed that reflectivity of the substrate material can be improved by a factor 15 - 90 in the 3 - 8 μm spectral region using gold or silver paste coatings. A transparent window is required in the differential gas cell structure in order to probe the displacement of the silicon cantilever. The transparent sapphire window was sealed to the LTCC substrate using two methods: screen printed Au80/Sn20 solder paste and pre-attached glass solder paste (Diemat DM2700P/H848). Both methods were shown to provide hermetic sealing of sapphire windows to LTCC substrate. The measured He-leak rate for the 10 sealed test samples implemented using glass paste were under 2.0 ×10-9 atm×cm3/s, which meets the requirement for the leak rate according to MIL-STD 883. The achieved hermeticity level suggests that the proof-of-principle packaging ...