People | Locations | Statistics |
---|---|---|
Naji, M. |
| |
Motta, Antonella |
| |
Aletan, Dirar |
| |
Mohamed, Tarek |
| |
Ertürk, Emre |
| |
Taccardi, Nicola |
| |
Kononenko, Denys |
| |
Petrov, R. H. | Madrid |
|
Alshaaer, Mazen | Brussels |
|
Bih, L. |
| |
Casati, R. |
| |
Muller, Hermance |
| |
Kočí, Jan | Prague |
|
Šuljagić, Marija |
| |
Kalteremidou, Kalliopi-Artemi | Brussels |
|
Azam, Siraj |
| |
Ospanova, Alyiya |
| |
Blanpain, Bart |
| |
Ali, M. A. |
| |
Popa, V. |
| |
Rančić, M. |
| |
Ollier, Nadège |
| |
Azevedo, Nuno Monteiro |
| |
Landes, Michael |
| |
Rignanese, Gian-Marco |
|
Słoma, Marcin
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (21/21 displayed)
- 2022Electromagnetic field controlled domain wall displacement for induced strain tailoring in BaTiO3-epoxy nanocompositecitations
- 2021Additive manufacturing of electronics from silver nanopowders sintered on 3D printed low-temperature substratescitations
- 2021Carbon nanotube-based composite filaments for 3d printing of structural and conductive elementscitations
- 2020Conductive ABS/Ni Composite Filaments for Fused Deposition Modeling of Structural Electronicscitations
- 2020Flexible Gas Sensor Printed on a Polymer Substrate for Sub-ppm Acetone Detectioncitations
- 2019Mechanical and thermal properties of ABS/iron composite for fused deposition modelingcitations
- 2019Photonic curing of silver paths on 3D printed polymer substratecitations
- 2019Heterophase materials for fused filament fabrication of structural electronicscitations
- 2018Electrically conductive acrylonitrile butadiene styrene(ABS)/copper composite filament for fused deposition modelingcitations
- 2018Characterization of PMMA/BaTiO3 Composite Layers Through Printed Capacitor Structures for Microwave Frequency Applicationscitations
- 2016Microwave properties of sphere-, flake-, and disc-shaped BaFe<inf>12</inf>O<inf>19</inf> nanoparticle inks for high-frequency applications on printed electronicscitations
- 2016Rheology of inks for various techniques of printed electronicscitations
- 2015Perovskite-type KTaO 3–reduced graphene oxide hybrid with improved visible light photocatalytic activitycitations
- 2015Influence of electric field on separation and orientation of carbon nanotubes in spray coated layerscitations
- 2015Simple optical method for recognizing physical parameters of graphene nanoplatelets materials
- 2014Thick Film Polymer Composites with Graphene Nanoplatelets for Use in Printed Electronics citations
- 2014Optical measurements of selected properties of nanocomposite layers with graphene and carbon nanotubes fillerscitations
- 2013Miniaturized coupled-line directional coupler designed with the use of photoimageable Thick-Film technology
- 2012Screen printed polymer pastes with carbon nanotubes for printed electronics applications
- 2012SAC 305 solder paste with carbon nanotubes - Part I: Investigation of the influence of the carbon nanotubes on the SAC solder paste propertiescitations
- 2010Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder jointscitations
Places of action
Organizations | Location | People |
---|
booksection
Mechanical and thermal properties of ABS/iron composite for fused deposition modeling
Abstract
• Fused deposition modeling is one of the most popular methods of additive manufacturing (AM). Typically, the thermoplastic polymer in the form of filament is melted in extrusion head and deposited layer by layer to fabricate object directly from 3D model data. Nowadays, FDM technology is also used to fabricate much more complex elements, like structural electronics or 3D printed electronics. Due to that, there is a necessity to develop new composite materials for this technology. In this work, an acrylonitrile butadiene styrene(ABS)/iron powder composite filament for use in 3D printing was fabricated by a two-stage solvent assisted processing method. Homogenously distributed iron powder in filaments with a filler content of 30 and 50 vol %, were fabricated using a single screw extruder machine. A static tensile test was carried out on samples printed from the developed composite materials. To demonstrate the thermal performance of 3D printed elements made with developed composites, exemplary heatsinks were printed. To exposed differences in thermal conductivity depending on iron powder contain, infrared thermography of printed objects was used. The results obtained were compared with the results for pure ABS prints. The research has shown that increasing filler content in composite filament decreases maximum engineering stress of materials but at the same time increase its thermal conductivity. Developed composites can be used to 3D print complicated and complex shaped heatsinks to improve thermal properties of 3D printed electronic circuits and objects.