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Rogers, Helen
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document
Polish-like facet preparation via dicing for silica integrated optics
Abstract
Preparation of high quality facets for low-loss coupling is a significant production issue for integrated photonics, usually requiring time consuming lapping and polishing. Recently, the development of precision dicing saws with diamond impregnated blades has allowed the achievement of optical grade surfaces in optical materials based on dicing alone. In this report we investigate the optimization dicing conditions to achieve optical quality surfaces in a silica-on-silicon planar substrate and show what can be achieved by correct selection of machining parameters.