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Muneeb, Muhammad
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Publications (7/7 displayed)
- 2023Improvement of the Self-Controlled Hyperthermia Applications by Varying Gadolinium Doping in Lanthanum Strontium Manganite Nanoparticlescitations
- 2022Unique design approach to realize an O-band laser monolithically integrated on 300 mm Si substrate by nano-ridge engineeringcitations
- 2016On-chip mid-infrared photothermal spectroscopy using suspended silicon-on-insulator microring resonatorscitations
- 2014Silicon-based photonic integration beyond the telecommunication wavelength rangecitations
- 2014Long-wavelength silicon photonic integrated circuits
- 2014Mid-IR heterogeneous silicon photonicscitations
- 2013III-V/silicon photonic integrated circuits for communication and sensing applicationscitations
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document
III-V/silicon photonic integrated circuits for communication and sensing applications
Abstract
In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.