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Baets, Roel
Ghent University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2016Low loss CMOS-compatible PECVD silicon nitride waveguides and grating couplers for blue light optogenetic applicationscitations
- 2016On-chip mid-infrared photothermal spectroscopy using suspended silicon-on-insulator microring resonatorscitations
- 2015Atomic layer deposited second-order nonlinear optical metamaterial for back-end integration with CMOS-compatible nanophotonic circuitrycitations
- 2014Silicon-based photonic integration beyond the telecommunication wavelength rangecitations
- 2014Long-wavelength silicon photonic integrated circuits
- 2014Mid-IR heterogeneous silicon photonicscitations
- 2013III-V/silicon photonic integrated circuits for communication and sensing applicationscitations
- 2012Near-infrared grating couplers for silicon nitride photonic wirescitations
- 2011Laser sources on a heterogeneous III-V/silicon platform
- 2009Silicon-organic hybrid (SOH): a platform for ultrafast optics
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document
III-V/silicon photonic integrated circuits for communication and sensing applications
Abstract
In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.