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Roelkens, Gunther
IMEC
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2022Gallium phosphide-on-insulator integrated photonic structures fabricated using micro-transfer printingcitations
- 2021Gallium phosphide transfer printing for integrated nonlinear photonics
- 2014Silicon-based photonic integration beyond the telecommunication wavelength rangecitations
- 2014Long-wavelength silicon photonic integrated circuits
- 2014Mid-IR heterogeneous silicon photonicscitations
- 2013III-V/silicon photonic integrated circuits for communication and sensing applicationscitations
- 2010Die-to-Die Adhesive Bonding for Evanescently-Coupled Photonic Devicescitations
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document
III-V/silicon photonic integrated circuits for communication and sensing applications
Abstract
In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.