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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Sarakinos, Kostas
University of Helsinki
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (37/37 displayed)
- 2024Unravelling the effect of nitrogen on the morphological evolution of thin silver films on weakly-interacting substratescitations
- 2023In situ and real-time studies of ultrathin silver films grown by physical vapor deposition
- 2022Manipulation of thin metal film morphology on weakly interacting substrates via selective deployment of alloying speciescitations
- 2021On the effect of copper as wetting agent during growth of thin silver films on silicon dioxide substratescitations
- 2021Clustering and Morphology Evolution of Gold on Nanostructured Surfaces of Silicon Carbidecitations
- 2021Clustering and Morphology Evolution of Gold on Nanostructured Surfaces of Silicon Carbide : Implications for Catalysis and Sensingcitations
- 2020The effect of kinetics on intrinsic stress generation and evolution in sputter-deposited films at conditions of high atomic mobilitycitations
- 2020In situ and real-time nanoscale monitoring of ultra-thin metal film growth using optical and electrical diagnostic toolscitations
- 2020Manipulation of epitaxial graphene towards novel properties and applicationscitations
- 20203D-to-2D morphology manipulation of sputter-deposited nanoscale silver films on weakly interacting substrates via selective nitrogen deployment for multifunctional metal contactscitations
- 2019Atomic-scale diffusion rates during growth of thin metal films on weakly-interacting substratescitations
- 2019Semi-empirical force-field model for the Ti 1-x Al x N (0 ≤ x ≤ 1) systemcitations
- 2019Semi-Empirical Force-Field Model For The Ti1-XAlXN (0 ≤ x ≤ 1) Systemcitations
- 2017Synthesis of tunable plasmonic metal-ceramic nanocomposite thin films by temporally modulated sputtered fluxescitations
- 2016A kinetic model for stress generation in thin films grown from energetic vapor fluxescitations
- 2016Compressive intrinsic stress originates in the grain boundaries of dense refractory polycrystalline thin filmscitations
- 2016Theoretical and experimental study of metastable solid solutions and phase stability within the immiscible Ag-Mo binary systemcitations
- 2015Coalescence-controlled and coalescence-free growth regimes during deposition of pulsed metal vapor fluxes on insulating surfacescitations
- 2014Principles for designing sputtering-based strategies for high-rate synthesis of dense and hard hydrogenated amorphous carbon thin filmscitations
- 2014Double in-plane alignment in biaxially textured thin filmscitations
- 2014Atomistic view on thin film nucleation and growth by using highly ionized and pulsed vapour fluxescitations
- 2014Deposition of yttria-stabilized zirconia thin films by high power impulse magnetron sputtering and pulsed magnetron sputteringcitations
- 2013Time-domain and energetic bombardment effects on the nucleation and coalescence of thin metal films on amorphous substratescitations
- 2013Atom insertion into grain boundaries and stress generation in physically vapor deposited filmscitations
- 2013Tilt of the columnar microstructure in off-normally deposited thin films using highly ionized vapor fluxescitations
- 2012Influence of ionization degree on film properties when using high power impulse magnetron sputteringcitations
- 2012Influence of ionization degree on film properties when using high power impulse magnetron sputteringcitations
- 2012An introduction to thin film processing using high-power impulse magnetron sputteringcitations
- 2012Growth of ti-C nanocomposite films by reactive high power impulse magnetron sputtering under industrial conditionscitations
- 2012Exploring the potential of high power impulse magnetron sputtering for growth of diamond-like carbon filmscitations
- 2010High power pulsed magnetron sputteringcitations
- 2010Ab initio study of effects of substitutional additives on the phase stability of γ -aluminacitations
- 2009On the phase formation of titanium oxide films grown by reactive high power pulsed magnetron sputteringcitations
- 2008Tailoring of structure formation and phase composition in reactively sputtered zirconium oxide films using nitrogen as an additional reactive gascitations
- 2007Process characteristics and film properties upon growth of TiOx films by high power pulsed magnetron sputteringcitations
- 2007The role of backscattered energetic atoms in film growth in reactive magnetron sputtering of chromium nitridecitations
- 2005Structural factors determining the nanomechanical performance of transition metal nitride films
Places of action
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article
Manipulation of thin metal film morphology on weakly interacting substrates via selective deployment of alloying species
Abstract
We demonstrate a versatile concept for manipulating morphology of thin (& LE;25 nm) noble-metal films on weakly interacting substrates using growth of Ag on SiO2 as a model system. The concept entails deployment of minority metallic (Cu, Au, Al, Ti, Cr, and Mo) alloying species at the Ag-layer growth front. Data from in situ and real-time monitoring of the deposition process show that all alloying agents-when deployed together with Ag vapor throughout the entire film deposition-favor two-dimensional (2D) growth morphology as compared to pure Ag film growth. This is manifested by an increase in the substrate area coverage for a given amount of deposited material in discontinuous layers and a decrease of the thickness at which a continuous layer is formed, though at the expense of a larger electrical resistivity. Based on ex situ microstructural analyses, we conclude that 2D morphological evolution under the presence of alloying species is predominantly caused by a decrease of the rate of island coalescence completion during the initial film-formation stages. Guided by this realization, alloying species are released with high temporal precision to selectively target growth stages before and after coalescence completion. Pre-coalescence deployment of all alloying agents yields a more pronounced 2D growth morphology, which for the case of Cu, Al, and Au is achieved without compromising the Ag-layer electrical conductivity. A more complex behavior is observed when alloying atoms are deposited during the post-coalescence growth stages: Cu, Au, Al, and Cr favor 2D morphology, while Ti and Mo yield a more pronounced three-dimensional morphological evolution. The overall results presented herein show that targeted deployment of alloying agents constitutes a generic platform for designing bespoken heterostructures between metal layers and technologically relevant weakly interacting substrates.& nbsp;Published under an exclusive license by the AVS. ; Peer reviewed