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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Jacobson, Joseph M.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2007Investigation of alternative compounds to poly(E-MA) as a polymeric surfactant for preparation of microcapsules by phase separation method.citations
- 2004Conductive nanostructure fabrication by focused ion beam direct-writing of silver nanoparticlescitations
- 2003Nanotectonics: Direct Fabrication of All-Inorganic Logic Elements and Micro-Electro-Mechanical Systems from Nanoparticle Precursors
- 2002Nanostructure fabrication by direct electron-beam writing of nanoparticlescitations
Places of action
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article
Conductive nanostructure fabrication by focused ion beam direct-writing of silver nanoparticles
Abstract
A focused ion beam has been used to directly pattern thin films of organometallic silver nanoparticles down to a resolution of 100nm. The unexposed regions were washed in hexane leaving the desired pattern, and subsequent annealing formed conductive, metallic features. Multiple-layer structures were also fabricated by spin-coating and exposing additional films of silver nanoparticles on top of already patterned structures. The sensitivity of the nanoparticles to 30keVGa+ ions was measured to be approximately 5μC∕cm2. Using this technique test structures were fabricated in two and three dimensions with resistivities as low as 288μΩcm and 13μΩcm for single- and multiple-layer structures, respectively, as compared to a value of 1.589μΩcm for bulk silver. To our knowledge, this is the highest demonstrated throughput for any electron or ion beam direct-write process utilizing metal-organic precursors.