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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Teixeira, S.
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Topics
Publications (13/13 displayed)
- 2021NUMERICAL SIMULATION OF SOLDER PASTE PRINTING ON THROUGH-HOLE COMPONENTS
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- 2017Photocatalytic degradation of recalcitrant micropollutants by reusable Fe<inf>3</inf>O<inf>4</inf>/SiO<inf>2</inf>/TiO<inf>2</inf> particlescitations
- 2016Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Compositescitations
- 2016TiO<inf>2</inf>/graphene oxide immobilized in P(VDF-TrFE) electrospun membranes with enhanced visible-light-induced photocatalytic performancecitations
- 2016Reusability of photocatalytic TiO <inf>2</inf> and ZnO nanoparticles immobilized in poly(vinylidene difluoride)-co-trifluoroethylenecitations
- 2016Ciprofloxacin wastewater treated by UVA photocatalysis: Contribution of irradiated TiO<inf>2</inf> and ZnO nanoparticles on the final toxicity as assessed by Vibrio fischericitations
- 2015Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospherecitations
- 2010In vivo evaluation of highly macroporous ceramic scaffolds for bone tissue engineeringcitations
- 2004Production of porus hydroxyapatite with potential for controlled drug delivery
- 2004Porous hydroxyapatite and glass reinforced hydroxyapatite for controlled release of sodium ampicillin
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document
NUMERICAL SIMULATION OF SOLDER PASTE PRINTING ON THROUGH-HOLE COMPONENTS
Abstract
The increased demand for smaller and more reliable electronic devices, pressures companies to tune and innovate the production methodologies, always aiming to decrease the production time while maintaining the products' quality. In the manufacturing of a Printed Circuit Board - PCB, there are two main types of electronic components, namely, Surface-Mount-Devices and Through-Hole components. Both connections are achieved through soldering, an essential manufacturing process that greatly affects the quality of the final product, and may compromise the lifetime of the PCB. While SMD components are commonly soldered by a reflow process, TH components are generally soldered by a wave soldering process. However, a PCB is generally composed of both types of components. Since both processes are too different in nature, the manufacturing of the board requires two separated mounting lines which represent increased costs and production time. Taking this into account, the present study investigates the usage of the reflow solder printing to deposit the solder paste on through-hole apertures both experimentally and numerically. In general, the results were similar showing a tendency for the solder paste to deposit on the aperture's right side. Nevertheless, the numerical model predicts a filling area greater (by 22%) than that verified experimentally.