Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2010Dielectric, Mechanical, and Thermal Properties of Low-Permittivity Polymer-Ceramic Composites for Microelectronic Applications42citations

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Chart of shared publication
Krupka, Jerzy
1 / 120 shared
Sumesh, George
1 / 1 shared
Prabhakaran, Anjana S.
1 / 1 shared
Mailadil, Sebastian T.
1 / 1 shared
Jacob, Philip
1 / 1 shared
Chart of publication period
2010

Co-Authors (by relevance)

  • Krupka, Jerzy
  • Sumesh, George
  • Prabhakaran, Anjana S.
  • Mailadil, Sebastian T.
  • Jacob, Philip
OrganizationsLocationPeople

article

Dielectric, Mechanical, and Thermal Properties of Low-Permittivity Polymer-Ceramic Composites for Microelectronic Applications

  • Krupka, Jerzy
  • Sumesh, George
  • Prabhakaran, Anjana S.
  • Mailadil, Sebastian T.
  • Sreekumar, Uma
  • Jacob, Philip
Abstract

A new low‐permittivity polymer–ceramic composite for packaging applications has been developed. The ceramic‐reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low‐loss, low‐permittivity Li2MgSiO4 (LMS) ceramics prepared by the solid‐state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li2MgSiO4‐reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. The experimentally observed relative permittivity, thermal expansion, and thermal conductivity were compared with theoretical models.

Topics
  • polymer
  • melt
  • dielectric constant
  • composite
  • thermal expansion
  • ceramic
  • thermal conductivity
  • melt mixing