| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Bowen, Jacob R.
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (22/22 displayed)
- 2020Enhanced Electromechanical Response in Sm and Nd Co-doped Ceriacitations
- 2018Deposition of highly oriented (K,Na)NbO 3 films on flexible metal substratescitations
- 2018Deposition of highly oriented (K,Na)NbO3 films on flexible metal substratescitations
- 2017Lattice constant measurement from electron backscatter diffraction patternscitations
- 20173D printed barium titanate/poly-(vinylidene fluoride) nano-hybrid with anisotropic dielectric propertiescitations
- 2014On the accuracy of triple phase boundary lengths calculated from tomographic image datacitations
- 2013Transmission Electron Microscopy Specimen Preparation Method for Multiphase Porous Functional Ceramicscitations
- 2013Transmission Electron Microscopy Specimen Preparation Method for Multiphase Porous Functional Ceramicscitations
- 2013Ion beam polishing for three-dimensional electron backscattered diffractioncitations
- 2013Two and three dimensional electron backscattered diffraction analysis of solid oxide cells materials
- 2013Diffusion of Nickel into Ferritic Steel Interconnects of Solid Oxide Fuel/Electrolysis Stackscitations
- 2013Diffusion of Nickel into Ferritic Steel Interconnects of Solid Oxide Fuel/Electrolysis Stackscitations
- 2012Effects of focused ion beam milling on electron backscatter diffraction patterns in strontium titanate and stabilized zirconiacitations
- 2012Durable and Robust Solid Oxide Fuel Cells
- 2010Texture evolution during tensile necking of copper processed by equal channel angular extrusioncitations
- 2010Quantitative data analysis methods for 3D microstructure characterization of Solid Oxide Cells
- 2008Nanoscale chemical analysis and imaging of solid oxide cellscitations
- 2004Microstructural parameters and flow stress in Al-0.13% Mg deformed by ECAE processingcitations
- 2003The effect of coarse second-phase particles on the rate of grain refinement during severe deformation processingcitations
- 2002First Joint Chinese-Danish Symposium: Characterisation of Microstructures. Extended abstracts
- 2002Orientation correlations in aluminium deformed by ECAEcitations
- 2002Orientation correlations in aluminium deformed by ECAEcitations
Places of action
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article
Effects of focused ion beam milling on electron backscatter diffraction patterns in strontium titanate and stabilized zirconia
Abstract
This study investigates the effect of focused ion beam (FIB) current and accelerating voltage on electron backscatter diffraction pattern quality of yttria‐stabilized zirconia (YSZ) and Nb‐doped strontium titanate (STN) to optimize data quality and acquisition time for 3D‐EBSD experiments by FIB serial sectioning. Band contrast and band slope were used to describe the pattern quality. The FIB probe currents investigated ranged from 100 to 5000 pA and the accelerating voltage was either 30 or 5 kV. The results show that 30 kV FIB milling induced a significant reduction of the pattern quality of STN samples compared to a mechanically polished surface but yielded a high pattern quality on YSZ. The difference between STN and YSZ pattern quality is thought to be caused by difference in the degree of ion damage as their backscatter coefficients and ion penetration depths are virtually identical. Reducing the FIB probe current from 5000to 100 pA improved the pattern quality by 20% for STN but only showed a marginal improvement for YSZ. On STN, a conductive coating can help to improve the pattern quality and 5 kV polishing can lead to a 100% improvement of the pattern quality relatively to 30 kV FIB milling. For 3D‐EBSD experiments of a material such as STN, it is recommended to combine a high kV FIB milling and low kV polishing for each slice in order to optimize the data quality and acquisition time.