| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Bastos Da Silva Fanta, Alice
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2023Thermal stability of hierarchical microstructural features in additively manufactured stainless steelcitations
- 2023Study in Phase-Transformation Temperature in Nitinol by In Situ TEM Heating
- 2023The effect of cyclic heat treatment on microstructure evolution during Plasma Arc Additive Manufacturing employing an SEM in-situ heating study
- 2023Probing the Effects of Cyclic Heating in Metal Additive Manufacturing by means of a Quasi in situ EBSD Study
- 2023Study of Phase-transformation Behavior in Additive Manufacturing of Nitinol Shape Memory Alloys by In Situ TEM Heating
- 2022Probing the role of grain boundaries in single Cu nanoparticle oxidation by in situ plasmonic scatteringcitations
- 2022Probing the role of grain boundaries in single Cu nanoparticle oxidation by in situ plasmonic scatteringcitations
- 2022Probing the role of grain boundaries in single Cu nanoparticle oxidation by in situ plasmonic scatteringcitations
- 2022High resolution crystal orientation mapping of ultrathin films in SEM and TEMcitations
- 2021Recent developments for the characterization of crystals and defects at the nanoscale using on-axis TKD in SEM
- 2021Challenges and perspectives of Transmission Kikuchi Diffraction for nanocrystalline materials characterization
- 2020Aminopropylsilatrane Linkers for Easy and Fast Fabrication of High-Quality 10 nm Thick Gold Films on SiO2 Substratescitations
- 2020Aminopropylsilatrane Linkers for Easy and Fast Fabrication of High-Quality 10 nm Thick Gold Films on SiO 2 Substratescitations
- 2019Metal-polymer hybrid nanomaterials for plasmonic ultrafast hydrogen detectioncitations
- 2018Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundariescitations
- 2017Influence of Ti and Cr Adhesion Layers on Ultrathin Au Filmscitations
- 2017Iron Oxide Films Prepared by Rapid Thermal Processing for Solar Energy Conversioncitations
- 2017Time-of-Flight Three Dimensional Neutron Diffraction in Transmission Mode for Mapping Crystal Grain Structurescitations
- 2017Time-of-Flight Three Dimensional Neutron Diffraction in Transmission Mode for Mapping Crystal Grain Structurescitations
- 2013Partial transformation of austenite in Al-Mn-Si TRIP steel upon tensile straining: an in situ EBSD studycitations
- 20093-D Analysis of Graphite Nodules in Ductile Cast Iron Using FIB-SEM
- 2008Three-dimensional EBSD study on the relationship between triple junctions and columnar grains in electrodeposited Co-Ni filmscitations
- 2007Orientation microscopy on nanostructured electrodeposited NiCo-Films
Places of action
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article
Three-dimensional EBSD study on the relationship between triple junctions and columnar grains in electrodeposited Co-Ni films
Abstract
Electrodeposited nanocrystalline materials are expected to have a homogeneous grain size and a narrow grain size distribution. In Co–Ni electrodeposited films, however, under certain conditions an undesired columnar grain structure is formed. Fully automated three‐dimensional (3D) orientation microscopy, consisting of a combination of precise material removal by focussed ion beam and subsequent electron backscatter diffraction (EBSD) analysis, was applied to fully characterize the grain boundaries of these columnar grains in order to gain further understanding on their formation mechanisms. Two‐dimensional orientation microscopy on these films indicated that the development of columnar grains could be related to the formation of low‐energy triple junctions. 3D EBSD allowed us to verify this suggestion and to determine the boundary planes of these triples. The triplets are formed by grain boundaries of different quality, a coherent twin on theplane, an incoherent twin and a large‐angle grain boundary. These three boundaries are related to each other by a rotation about the 〈〉 direction. A second particularity of the columnar grains is the occurrence of characteristic orientation gradients created by regular defects in the grain. Transmission electron microscopy was applied to investigate the character of the defects. For this purpose, a sample was prepared with the focussed ion beam from the last slice of the 3D EBSD investigation. From the TEM and 3D EBSD observations, a growth mechanism of the columnar grains is proposed.