• Thomsen, Erik Vilain
• Jensen, Jørgen Arendt
• Hansen, Jesper Mark Fly
• Engholm, Mathias
• Diederichsen, Søren Elmin

Abstract

This paper presents an experimental study of the acoustic performance of Capacitive Micromachined Ultrasonic Transducers (CMUTs) as function of plate dimensions. The objective is to increase the output pressure without decreasingthe pulse-echo signal. The CMUTs are fabricated with a LOCOS process, followed by direct wafer fusion bonding to a Silicon-On-Insulator (SOI) wafer. In this way, the plate thickness is determined by the SOI wafer device layer thickness, resulting in CMUTs with plate thicknesses of 2, 9.3 and 15 μm. The corresponding radii and gap heights resulting in an immersion frequency of 5MHz and a pull-in voltage of 200V are obtained using finite element analysis. Hydrophone and plane reflector measurements are used to assess the acoustic performance. Increasing the plate thickness from 2μm to 15μm decreases the pulse-echo bandwidth from >100% to 30%. A maximum in both peak-to-peak output pressure and pulse-echo signal is obtained for the 9.3μm plate, which still has a moderate pulseecho bandwidth of 60%. The 9.3μm plate results in a 1.9 times higher peak-to-peak output pressure and a 3.6 times higherpulse-echo signal compared to the 2μm plate. By adjusting the plate dimensions of a CMUT it is possible to optimize its acoustic performance for medical imaging applications, including visualization of deeper structures in the body, as well as nonlinear imaging such as tissue harmonic imaging.

Topics

• impedance spectroscopy
• Silicon
• ultrasonic
• finite element analysis