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| Azevedo, Nuno Monteiro |
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Bernassau, Anne L.
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2012Acoustic tweezing at the nodes or antinodes of a heptagonal multi piezoelectric transducer cellcitations
- 2012Microfabrication of electrode patterns for high-frequency ultrasound transducer arrayscitations
- 2011Characterization of an epoxy filler for piezocomposites compatible with microfabrication processescitations
- 2009Concepts and issues in piezo-on-3D silicon structurescitations
- 2008Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices
- 2008Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processescitations
- 2007Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrayscitations
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document
Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes
Abstract
High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.