| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vopson, Melvin Marian
University of Portsmouth
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2020Diamagnetic coupling for magnetic tuning in nano-thin filmscitations
- 2019Sub-lattice polarization states in anti-ferroelectrics and their relaxation processcitations
- 2019Evidence of substrate roughness surface induced magnetic anisotropy in Ni80Fe20 flexible thin filmscitations
- 20171D core-shell magnetoelectric nanocomposites by template-assisted liquid phase depositioncitations
- 2012Probing the local strain-mediated magnetoelectric coupling in multiferroic nanocomposites by magnetic field-assisted piezoresponse force microscopycitations
- 2012Nanostructured p-n junctions for kinetic-to-electrical energy conversioncitations
- 2005Preparation of high moment CoFe films with controlled grain size and coercivitycitations
- 2005Deposition of polycrystalline thin films with controlled grain sizecitations
- 2005Grain size effects in metallic thin films prepared using a new sputtering technology
- 2004Novel sputtering technology for grain-size controlcitations
Places of action
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article
Novel sputtering technology for grain-size control
Abstract
In this paper, we present a description of a novel high-rate plasma sputtering system that allows the control of grain size in sputtered films. Additionally, the system has the advantage of a better utilization of the target material (around 80% to 90%) by eliminating the race track at the target as in conventional plasma magnetron sputtering systems. The potential and capabilities of this novel plasma sputtering device are demonstrated in this paper by the deposition of a number of different Cr thin films suitable for underlayers in thin-film media and for which we have performed a systematic X-ray and TEM analysis to determine the grain-size histograms, mean grain diameters, and their relationship to the sputtering processes.