| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vanfleteren, Jan
IMEC
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (24/24 displayed)
- 2023Methods to improve accuracy of electronic component positioning in thermoformed electronicscitations
- 2022Innovative component positioning method for thermoformed electronicscitations
- 2022A study on over-molded copper-based flexible electronic circuitscitations
- 2021Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resincitations
- 2020Flexible microsystems using over-molding technologycitations
- 2020Solar cells integration in over-molded printed electronicscitations
- 2019Effect of overmolding process on the integrity of electronic circuitscitations
- 20183D multifunctional composites based on large-area stretchable circuit with thermoforming technologycitations
- 2017Stretchable electronic platform for soft and smart contact lens applicationscitations
- 2017Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymerscitations
- 2016One-time deformable thermoplastic devices based on flexible circuit board technologycitations
- 2016RTM Production Monitoring of the A380 Hinge Arm Droop Nose Mechanism: A Multi-Sensor Approachcitations
- 2016Stretchable electronic platform for soft and smart contact lens applications
- 2015Design, construction and testing of a COC 3D flow-over flow-through bioreactor for hepatic cell culture
- 2015Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)
- 20152.5D smart objects using thermoplastic stretchable interconnectscitations
- 2015Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
- 2013Stretchable electronics technology for large area applications: fabrication and mechanical characterizationcitations
- 2013Parylene C for hermetic and flexible encapsulation of interconnects and electronic components
- 2012Biocompatible packaging solutions for implantable electronic systems for medical applications
- 2011The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnectscitations
- 20113D-stacking of UTCPs as a module miniaturization technology
- 2007Design of metal interconnects for stretchable electronic circuits using finite element analysiscitations
- 2002An O/E measurement probe based on an optics-extended MCM-D motherboard technology
Places of action
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article
Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resin
Abstract
Flexible dielectric sensors received significant interest for real-time in situ cure monitoring of polymeric composites over the past decade. Currently, the state-of-the-art dielectric sensors mainly focus on detecting the distinct stages of the polymeric composite curing process. While low-cost and quantitative monitoring of the thermal, mechanical, and chemical properties of the materials during the cure is of great interest, to date, such a sensor system has not been realized because the existing devices excessively depend on external instrumentations, combined with a lack of an embedded reliable data processing module. Here, a fully integrated dielectric monitoring sensor system (DMS) incorporating dielectric and temperature sensors is developed, capable of monitoring in real-time the temperature, the degree of cure, and the glass transition temperature (T-g) of polymeric composites. An independent characterization of the cure kinetics was performed using differential scanning calorimetry and Raman spectroscopy. These data enabled associating the main physical and chemical transformations in the polymeric materials with particular features observed in the dielectric measurements. We demonstrate the accurate estimation of the degree of cure and T-g of an epoxy resin. The proposed system shows the potential for a new generation of intelligent manufacturing technology of composite materials.