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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Keränen, Kimmo
VTT Technical Research Centre of Finland
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2020The Effect of Torsional Bending on Reliability and Lifetime of Printed Silver Conductorscitations
- 2019Wireless Powering for Glass-Laminated Functionalities
- 2012Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanescitations
- 2012Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanescitations
- 2012Printed hybrid systemscitations
- 2012Hot laminated multilayer polymer illumination structure based in embedded LED chipscitations
- 2010Differential photoacoustic gas cell based on LTCC for ppm gas sensingcitations
- 2009Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substratecitations
- 2008Photonic module integration based on silicon, ceramic and plastic technologies
- 2007The studies of the illumination/detection module in Integrated Microinterferometric Extensometer
- 2007Inmould integration of a microscope add-on system to a 1.3 Mpix camera phonecitations
- 2006Fiber pigtailed multimode laser module based on passive device alignment on an LTCC substratecitations
- 2006Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate
- 2002Fiberoptic in-vessel viewing system for the international thermonuclear experimental reactorcitations
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article
The Effect of Torsional Bending on Reliability and Lifetime of Printed Silver Conductors
Abstract
<p>Capability of high-speed and low-cost manufacturing makes the printing techniques a very promising approach for large-area flexible electronics mass manufacturing. Due to fast and intensive technology development, the lack of knowledge about the reliability and lifetime of printed electronics is obvious, requiring further investigation. Especially, the effect of torsional bending on lifetime is a mostly unexplored field of reliability testing. In this article, a torsional bending test of parallel printed silver conductors (0.3-, 0.5-mm pitch) on polymer substrate (polyethylene terephthalate, 125-{m} thickness) was conducted and analyzed. According to the experimental results, torsional bending causes wear-out type failures in conductors and the length-to-width (LTW) ratio of the sample's substrate was observed to have a significant impact on reliability. If the LTW ratio is smaller than 3, the lifetime of printed conductor seems to collapse and samples lasted for approximately only 17 bending cycles on average. Lifetime was improved by increasing the LTW ratio and samples withstood over hundreds of cycles with LTW ratio of higher than 15. However, the distance of a conductor from the edge of the substrate was not observed to have any significant influence on the reliability under torsional bending.</p>