| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Marques-Hueso, Jose
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2023Upconversion 3D printing enhancement via silver sensitization to enable selective metallizationcitations
- 2023Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coatingcitations
- 2022Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallizationcitations
- 2022Routes towards manufacturing biodegradable electronics with polycaprolactone (PCL) via direct light writing and electroless platingcitations
- 2020Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systemscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Photolithographic nanoseeding method for selective synthesis of metal-catalysed nanostructurescitations
- 2019Selective Metallization of 3D Printable Thermoplastic Polyurethanescitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2014Physical performance limitations of luminescent down-conversion layers for photovoltaic applicationscitations
- 2013Enhanced up-conversion for photovoltaics using 2D photonic crystalscitations
- 2012Optical properties of lanthanide dyes for spectral conversion encapsulated in porous silica nanoparticles
- 2012Nanoplasmonics for photovoltaic applicationscitations
- 2012Plasmon dumping in Ag-nanoparticles/polymer composite for optical detection of amines and thiols vaporscitations
Places of action
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article
Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite
Abstract
This paper presents a novel, direct, selective, vacuum-free, and low-cost method of electroless copper deposition, allowing additive patterning of nonconductive surfaces. Ag nanoparticles (NPs) synthesized inside a photosensitive polymer are acting as seeds for electroless copper deposition. The resulting copper film surface morphology was studied with scanning electron microscopy. Copper films were shown to display a rough grainlike structure, covering substrate uniformly with good metal-substrate adhesion. Copper thickness was studied as a function of the plating time, temperature, and Ag NPs seed concentration. A maximal copper thickness of 0.44 ± 0.05 μm was achieved when plated at 30 °C with 0.4 M Ag(I). The minimum feature resolution of copper patterns, grown with 0.025- and 0.1-M silver salt, is attained down to 10 μm. The maximum electrical conductivity of the copper film prepared with 0.025-, 0.1-, and 0.4-M Ag(I) approaches (0.8 ± 0.1) × 107 S/m, (1.1 ± 0.1)×107 S/m and (1.6 ± 0.4)×107 S/m, respectively. Electroless copper interconnections and LED circuit on glass substrate were fabricated as a proof of concept demonstrators.