Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Universitat Autònoma de Barcelona

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (2/2 displayed)

  • 2017Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application22citations
  • 2016Evaluation of Aerosol, Superfine Inkjet, and Photolithography Printing Techniques for Metallization of Application Specific Printed Electronic Circuits30citations

Places of action

Chart of shared publication
Sowade, Enrico
1 / 3 shared
Sternkiker, Christoph
1 / 1 shared
Baumann, Reinhard R.
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Mitra, Kalyan Yoti
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Ramon, Eloi
1 / 5 shared
Gomes, Henrique Leonel
1 / 2 shared
Martinez-Domingo, Carme
1 / 1 shared
Winchester, Lee
1 / 1 shared
Mashayekhi, Mohammad
1 / 1 shared
Pease, Tim
1 / 1 shared
Evans, Louise
1 / 1 shared
Mantysalo, Matti
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Laurila, Mika Matti
1 / 2 shared
Ogier, Simon
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Terés, Lluís
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Chart of publication period
2017
2016

Co-Authors (by relevance)

  • Sowade, Enrico
  • Sternkiker, Christoph
  • Baumann, Reinhard R.
  • Mitra, Kalyan Yoti
  • Ramon, Eloi
  • Gomes, Henrique Leonel
  • Martinez-Domingo, Carme
  • Winchester, Lee
  • Mashayekhi, Mohammad
  • Pease, Tim
  • Evans, Louise
  • Mantysalo, Matti
  • Laurila, Mika Matti
  • Ogier, Simon
  • Terés, Lluís
OrganizationsLocationPeople

article

Evaluation of Aerosol, Superfine Inkjet, and Photolithography Printing Techniques for Metallization of Application Specific Printed Electronic Circuits

  • Winchester, Lee
  • Mashayekhi, Mohammad
  • Carrabina, Jordi
  • Pease, Tim
  • Evans, Louise
  • Mantysalo, Matti
  • Laurila, Mika Matti
  • Ogier, Simon
  • Terés, Lluís
Abstract

© 2016 IEEE. Application specific printed electronic circuits (ASPECs) are the corresponding term with application-specified ICs for printed electronics. The same as any new technology, printed electronics is suffering from some restrictions in design and process technology aspects. An important stage in the ASPEC design is the final wiring of the organic thin-film transistor arrays or gate arrays to customize it to implement any specific target application that fits in their structure. In this paper, we evaluate two additive manufacturing technologies: aerosol jet using Optomec M3D and electrohydrodynamic printer using superfine inkjet. Both techniques are based on direct-writing of the pattern corresponding to any individual circuit being fabricated (digital printing) enabled by the mask-free noncontact deposition of materials. Finally, these structures will be compared with the corresponding photolithography mask technology. Some parameterized test vehicles, with different instantiations for the variation of line widths and separations, have been designed to be wired using the target technologies. These test vehicles have been fabricated at the Centre for Process Innovation by a five masks lithography and subtractive patterning technology. Results show that both direct printing technologies are feasible for the fabrication of the gate-array customization, thus allowing individual personalization of every circuit what can produce added value functionalities at low cost such as the equivalent effect of having an ROM memory which final contents could be customized at home by using low-cost digital printing technologies. Further interactions between transistor bulk and wiring technologies can improve the obtained performance in order to end up in an industrialized process.

Topics
  • Deposition
  • impedance spectroscopy
  • additive manufacturing
  • lithography
  • ion chromatography