People | Locations | Statistics |
---|---|---|
Naji, M. |
| |
Motta, Antonella |
| |
Aletan, Dirar |
| |
Mohamed, Tarek |
| |
Ertürk, Emre |
| |
Taccardi, Nicola |
| |
Kononenko, Denys |
| |
Petrov, R. H. | Madrid |
|
Alshaaer, Mazen | Brussels |
|
Bih, L. |
| |
Casati, R. |
| |
Muller, Hermance |
| |
Kočí, Jan | Prague |
|
Šuljagić, Marija |
| |
Kalteremidou, Kalliopi-Artemi | Brussels |
|
Azam, Siraj |
| |
Ospanova, Alyiya |
| |
Blanpain, Bart |
| |
Ali, M. A. |
| |
Popa, V. |
| |
Rančić, M. |
| |
Ollier, Nadège |
| |
Azevedo, Nuno Monteiro |
| |
Landes, Michael |
| |
Rignanese, Gian-Marco |
|
Mitsche, Stefan
Graz University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (40/40 displayed)
- 2024Microstructure and Mechanical Properties of Ti-6Al-4V In Situ Alloyed with 3 wt% Cr by Laser Powder Bed Fusion
- 2024Modeling the concurrent growth of inter- and intragranular Si precipitates during slow cooling of the alloy AA6016
- 2024Three-dimensional distribution of individual atoms in the channels of beryl
- 2024Three-dimensional distribution of individual atoms in the channels of berylcitations
- 2024Phase Transitions and Ion Transport in Lithium Iron Phosphate by Atomic‐Scale Analysis to Elucidate Insertion and Extraction Processes in Li‐Ion Batteriescitations
- 2024Water as a Sustainable Leaching Agent for the Selective Leaching of Lithium from Spent Lithium-Ion Batteriescitations
- 2024How to properly investigate recrystallization in wrought aluminum alloys
- 2024Manufacturing and processing of sheets using a Mg–Al–Ca–Zn–Y alloy for automotive applicationscitations
- 2024Investigation of the texture development of rolled aluminum alloy sheets during constant heating using in situ EBSD
- 2024Recrystallization in Wrought Aluminum Alloys - A Critical Evaluation of Characterization Methods
- 2023Microstructural evolution in cold rolled aluminum alloys during recrystallization – an in situ electron backscatter diffraction study
- 2023Microstructure of a modulated Ti-6Al-4V – Cu alloy fabricated via in situ alloying in laser powder bed fusioncitations
- 2023Investigation of recrystallization processes in aluminum alloys - in situ electron backscatter diffraction optimized for annealing at constant heating rates
- 2022Influence of Strain Rate Sensitivity on Cube Texture Evolution in Aluminium Alloyscitations
- 2022Feasibility Study Of Fabricating A Partly Amorphous Copper-Rich Titanium Alloy Via In-Situ Alloying In Laser Powder Bed Fusion
- 2022Direct-Write 3D Nanoprinting of High-Resolution Magnetic Force Microscopy Nanoprobes
- 2021Laser powder bed fusion of nano-CaB6 decorated 2024 aluminum alloycitations
- 2021Numerical investigation of the effect ofrate-sensitivity, non-octahedral slip and grain shape on texture evolution during hot rolling of aluminum alloyscitations
- 2021High-Resolution Microstructure Characterization of Additively Manufactured X5CrNiCuNb17-4 Maraging Steel during Ex and In Situ Thermal Treatmentcitations
- 2020Evolution of microstructure and texture in laboratory- and industrial-scaled production of automotive Al-sheetscitations
- 2020Viscoplastic Self-consistent Modeling of the Through-Thickness Texture of a Hot-Rolled Al-Mg-Si Platecitations
- 2020Microstructure Investigations of Powders and Additive Manufactured Partscitations
- 2019Preparation Method of Spherical and Monocrystalline Aluminum Powdercitations
- 2019Influence of Melt-Pool Stability in 3D Printing of NdFeB Magnets on Density and Magnetic Propertiescitations
- 2019Recrystallized cube grains in an Al–Mg–Si alloy dependent on prior cold rollingcitations
- 2018Microstructure evolution in a 6082 aluminium alloy during thermomechanical treatmentcitations
- 2018Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Testscitations
- 2016Dissimilar Electron Beam Welds of Nickel Base Alloy A625 with a 9% Cr-Steel for High Temperature Applications
- 2016Unified description of the softening behavior of beta-metastable and alpha plus beta titanium alloys during hot deformationcitations
- 2014Advanced Microstructures for Increased Creep Rupture Strength of MARBN Steelscitations
- 2014Investigations into the delayed fracture susceptibility of 34CrNiMo6 steel, and the opportunities for its application in ultra-high-strength bolts and fastenerscitations
- 2013Investigations on susceptibility to intergranular corrosion of thermo-mechanically rolled corrosion-resistant materials 316L and Alloy 825citations
- 2013Microstructural evolution of AA6082 with small aluminides under hot torsion and friction stir processingcitations
- 2013FE modelling of microstructure evolution during friction stir spot welding in AA6082-T6citations
- 2012Investigation of friction stir welding of stainless steel using a stop-action-techniquecitations
- 2012Influence of temperature and strain rate on dynamic softening processes in AllvacR 718PlusTMcitations
- 2011The Impact of Weld Metal Creep Strength on the Overall Creep Strength of 9% Cr Steel Weldmentscitations
- 2011Assessment of dynamic softening mechanisms in Allvac® 718Plus™ by EBSD analysiscitations
- 2008δ-phase characterization of superalloy Allvac 718 Plus™
- 2007Recrystallization behaviour of the nickel-based alloy 80 a during hot formingcitations
Places of action
Organizations | Location | People |
---|
article
Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests
Abstract
Die-to-wafer interconnections such as copper pillars play a vital role in order to enable 3-D integration. This interconnection type allows increasing the density of interconnects but the occurrence of defects, especially intermetallic compounds (IMC) and Kirkendall voids, may reduce the lifetime at elevated operating conditions. This paper investigates the physical degradation mechanisms in copper pillars and micro-bumps, caused by IMC and void formation during stress tests such as electromigration (EM) and high temperature storage. The resistance evolution of the tested interconnections motivated the derivation of a novel analytical model to separate the resistance increases caused by IMC growth and void formation. This allows the real time monitoring of changes in the kinetics, which gives a better understanding of the underlying physics and of the failure mechanisms. In order to validate the model, an additional test series on copper pillars under EM stress with varying conditions is conducted and the model is applied on the monitored resistance evolution. The different stress conditions allowed the extraction of the IMC formation activation energy, which is compared against parameter extraction using classical mean time to failure analysis as well as material parameters of IMC growth that are already reported in the literature.