| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Skrotzki, Werner
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (27/27 displayed)
- 2025Strengthening mechanisms in Ni and Ni-5Fe alloycitations
- 2024Grain Boundary Sliding During High Pressure Torsion of Nanocrystalline Au‐13Pd Alloy
- 2024Texture of Hot-Compressed Metastable β-Titanium Alloy Ti5321 Studied by Neutron Diffraction
- 2024Adaptive Phase or Variant Formation at the Austenite/Twinned Martensite Interface in Modulated Ni–Mn–Ga Martensitecitations
- 2024Severe plastic deformation for producing superfunctional ultrafine-grained and heterostructured materials: An interdisciplinary review
- 2024Severe plastic deformation for producing Superfunctional ultrafine-grained and heterostructured materials: An interdisciplinary reviewcitations
- 2023Diffusion of Silver in Liquid Tin Depending on the Temperature Gradient Along the Solder in Low-Voltage Power Fuses at Overcurrents
- 2022Phase transformation induced by high pressure torsion in the high-entropy alloy CrMnFeCoNicitations
- 2021Surface hardening of high- and medium-entropy alloys by mechanical attrition at room and cryogenic temperaturescitations
- 2020Low temperature deformation mechanisms of single crystalline intermetallic compound YAgcitations
- 2020Effect of Stacking Fault Energy on Microstructure and Texture Evolution during the Rolling of Non-Equiatomic CrMnFeCoNi High-Entropy Alloys
- 2020Microstructure, Texture, and Strength Development during High-Pressure Torsion of CrMnFeCoNi High-Entropy Alloy
- 2018Deformation mechanisms of nil temperature ductile polycrystalline B2 intermetallic compound YAgcitations
- 2018Role of Grain Boundary Sliding in Texture Evolution for Nanoplasticitycitations
- 2018Universal scaling behavior of the upper critical field in strained FeSe0.7Te0.3 thin filmscitations
- 2018Revealing Grain Boundary Sliding from Textures of a Deformed Nanocrystalline Pd–Au Alloycitations
- 2017The influence of the in-plane lattice constant on the superconducting transition temperature of FeSe0.7Te0.3 thin films
- 2016Mechanical properties, structural and texture evolution of biocompatible Ti–45Nb alloy processed by severe plastic deformationcitations
- 2016Ti/Al multi-layered sheets: Differential speed rolling (Part B)citations
- 2016Hall-plot of the phase diagram for Ba(Fe1-xCox)2As2citations
- 2016Hall-plot of the phase diagram for Ba(Fe1−xCox)2As2
- 2016Shear-Coupled Grain Growth and Texture Development in a Nanocrystalline Ni-Fe Alloy during Cold Rollingcitations
- 2015Factors influencing the elastic moduli, reversible strains and hysteresis loops in martensitic Ti-Nb alloyscitations
- 2013Processing of intermetallic titanium aluminide wirescitations
- 2013Thermal stability and phase transformations of martensitic Ti-Nb alloyscitations
- 2011Ti-Al composite wires with high specific strengthcitations
- 2010Studies of fatigue crack propagation : a multiscale cohesive zone model
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article
Diffusion of Silver in Liquid Tin Depending on the Temperature Gradient Along the Solder in Low-Voltage Power Fuses at Overcurrents
Abstract
Low-voltage power fuses in new applications in dc networks are faced with changing requirements. Fast and reliable switching characteristics are needed, particularly to protect photovoltaic and battery storage systems. Due to the short fusing times in the event of short circuits, fuse elements made of silver are used. A tin solder is applied to the silver fuse element to protect the circuit from overcurrents. In the case of overcurrents in particular, the requirements for fuses in photovoltaic systems have changed compared to conventional semiconductor protection measures. For this reason, the fusing behavior at low overcurrents was investigated for silver fuse elements with tin solder. The diffusion from silver into liquid tin was analyzed during the fusing process. In the case of the latter, the influence of the temperature gradient along the solder was investigated as a design criterion in addition to the absolute temperature. A shorter fusing time with less scatter was found for specially adapted fuse elements with higher temperature gradients along the solder. The respective diffusion process could be analyzed based on microsections of the solder from interrupted fusing tests. For this purpose, energy-dispersive X-ray spectroscopy (EDX) measurements and threshold segmentations of the microsections were carried out. The temperature gradient along the solder initiated convective movements of silver atoms within the solder. More silver was dissolved in the liquid tin on the warmer side of the solder. Silver-rich particles precipitated on the cooler side of the solder and kept the concentration gradient up on the warmer side. The faster fusing process at higher temperature gradients could be correlated with an altered diffusion mechanism. With these investigations, a new and significant design parameter for fuse elements was determined. Silver fuse elements for protection of overcurrents in full-range fuses can now be easily adapted to new and future requirements.