| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Li, Feng
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2023Effect of degree of substitution on the microphase separation and mechanical properties of cellooligosaccharide acetate-based elastomerscitations
- 2022Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effectscitations
- 2022Singlet and triplet to doublet energy transfer: improving organic light-emitting diodes with radicals
- 2022Amino acids as activators for wave solder flux systems: Investigation of solderability and humidity effectscitations
- 2022Singlet and triplet to doublet energy transfer: improving organic light-emitting diodes with radicals.
- 2021Alkanolamines as activators in no-clean flux systems: investigation of humidity robustness and solderabilitycitations
- 2020Humidity Robustness of Plasma-Coated PCBscitations
- 2020Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliabilitycitations
- 2020Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloyscitations
- 2018On the ductility of alpha titanium: The effect of temperature and deformation modecitations
- 2018On the ductility of alpha titanium: The effect of temperature and deformation modecitations
- 2018Corrosion Reliability of Lead-Free Solder Systems Used in Electronicscitations
- 2017Lubrication of aluminium versus diamond-like carbon contacts with hydrophobin proteinscitations
- 2017Corrosion reliability of lead-free solder systems used in electronicscitations
Places of action
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article
Amino acids as activators for wave solder flux systems: Investigation of solderability and humidity effects
Abstract
The role of flux activators in flux formulation is to remove oxides from metal surface, hence allow the formation of metallurgical bond between metal substrate and solder alloy. However, flux activator in the no-clean flux residue on printed circuit board assemblies (PCBAs) affects the climatic reliability due to its hygroscopic and ionic behavior under humidity exposure. Four amino acids-based wave flux were investigated using wetting balance test and microscopy inspection, and the humidity effects of four amino acids was analyzed using electrochemical impedance spectroscopy (EIS) and chronoamperometry under various testing conditions. Water absorption and thermal degradation were analyzed using gravimetric method and Fourier-transform infrared spectroscopy (FT-IR). Combined results indicate glutamine based model flux obtained superior solderability for 96.5Sn-3Ag-0.5Cu (SAC 305) alloy due to suitable melting and activation temperature of amino group for the oxides removal. The robust humidity reliability of amino acids was dependent upon relative high deliquescence point and low moisture absorption under harsh climatic conditions.