| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Panchenko, Juliana
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Opticscitations
- 2023Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applicationscitations
- 2023Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integrationcitations
- 2022Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solutioncitations
- 2022Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integrationcitations
- 2022Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermographycitations
- 2020Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testingcitations
- 2020Low temperature solid state bonding of Cu-In fine-pitch interconnects
- 2020Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Ballscitations
- 2020Grain Structure Analysis of Cu/SiO2Hybrid Bond Interconnects after Reliability Testingcitations
- 2019Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stackingcitations
- 2018Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Ballscitations
- 2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integrationcitations
- 2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumpscitations
- 2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposercitations
- 2014Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnectscitations
- 2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffractioncitations
- 2012Effects of bonding pressure on quality of SLID interconnectscitations
- 2011The creep behaviour and microstructure of ultra small solder jointscitations
- 2011Solidification processes in the Sn-rich part of the SnCu systemcitations
- 2010Microstructure Characterization Of Lead‐Free Solders Depending On Alloy Compositioncitations
- 2010The scaling effect on microstructure and creep properties of Sn-based solderscitations
- 2010Metallographic preparation of the SnAgCu solders for optical microscopy and EBSD Investigationscitations
Places of action
| Organizations | Location | People |
|---|
article
Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Balls
Abstract
This article focuses on the morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in small Sn-Ag-Cu (Ø 270 μm) solder balls. The Cu6Sn5 phase showed a large variety of different shapes and sizes, ranging from facetted hexagonal rods, to partly facetted splitting crystals and parallel growing branches, to dendritic crystals without facets. The results of electron backscatter diffraction (EBSD) measurements confirm [0001] as the major growth direction and the {101̅0} planes as facets of the hexagonal rods. The formation of crystals splitting parallel to the {101̅0} planes may be caused by a slight deviation of the major growth direction toward (21̅1̅0). Primary Ag3Sn intermetallics showed less morphology variations and solidified as typical plate structures with a planar and an irregular side. Sixfold starshaped formations of multiple plates arranged around a common center have been investigated by EBSD. All plates appear to have the same hexagonal orientation and possible growth directions are parallel to the {101̅0} planes. However, these pseudohexagonal structures showed color differences between plates of different growth directions, if investigated with polarized light microscopy. Those orientation differences were not detectable by EBSD. Possible interpretations are discussed on the basis of the orthorhombic distorted lattice and by possible twinning mechanisms.