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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Mannan, Samjid Hassan
King's College London
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (29/29 displayed)
- 2020High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticlescitations
- 2019Influence of Zn concentration on interfacial intermetallics during liquid and solid state reaction of hypo and hypereutectic Sn-Zn solder alloyscitations
- 2019Arresting High-Temperature Microstructural Evolution inside Sintered Silvercitations
- 2017Review of silver nanoparticle based die attach materials for high power/temperature applicationscitations
- 2016Microstructural evolution of sintered silver at elevated temperaturescitations
- 2016Reactions in electrodeposited Cu/Sn and Cu/Ni/Sn nanoscale multilayers for interconnectscitations
- 2016Thermally stable high temperature die attach solutioncitations
- 2015Electromigration Phenomena in Sintered Nanoparticle Ag Systems Under High Current Density
- 2015Factors influencing microstructural evolution in nanoparticle sintered Ag die attachcitations
- 2014A review: On the development of low melting temperature Pb-free solderscitations
- 2013Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additivescitations
- 2012Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solderscitations
- 2012Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reactioncitations
- 2012Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substratescitations
- 2010Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates citations
- 2009Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Millingcitations
- 2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectscitations
- 2007Dissolution and interfacial reaction of Nb in contact with the molten 521n-48Sn soldercitations
- 2007Failure mechanisms of dummy IGBT assembles constructed using liquid In-Sn/Nb system
- 2006Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnectscitations
- 2006Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assembliescitations
- 2006Edge effects in intermetallic compound crystal growth between Nb and molten 52In-48Sn solder
- 2005Study of intermetallic crystal growth between Nb and molten 52In-48Sn soldercitations
- 2004Materials and processes for implementing high-temperature liquid interconnectscitations
- 2004Dissolution of solids in contact with liquid soldercitations
- 2002Electroless nickel bumping of aluminum bondpads - Part II: Electroless nickel platingcitations
- 2000Solder paste reflow modeling for flip chip assembly
- 2000Investigation of a solder bumping technique for flip-chip interconnection
- 2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositioncitations
Places of action
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article
Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives
Abstract
<p>In this paper, we report a comparison of interfacial reactions of Sn-3.8Ag-0.7Cu (SAC 387) and SAC (0-1.5 Zn) solder pastes on Cu (organic solderability preservative finish) and Au/Ni-P/Cu [electroless Ni immersion gold (ENIG)] substrate metallizations with Ni/Sn and Cu/Sn plated component leads. Zn added to the paste in the form of surface-coated micrometer-sized particles dissolves into the solder during reflow. High-temperature aging (150 degrees C and 185 degrees C), thermal cycling experiments (-20 degrees C to 175 degrees C for FR4 substrate, -40 degrees C to 185 degrees C for ENIG polyimide substrate), and shear testing of the solder joints were carried out. At a Cu interface, adding Zn to the solder joint improves the shear strength and suppresses Cu3Sn and overall interfacial intermetallic compound (IMC) and Kirkendall void formation <175 degrees C. However, above this temperature, the presence of Zn accelerates IMC growth. At a Ni interface, IMC suppression with Zn was noted at all temperatures. The amount of IMC suppression depends on the Zn concentration in the IMCs, which in turn depends on the geometry of joint as well as the original concentration of Zn in the solder.</p>