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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Green, Mark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (15/15 displayed)
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2021Investigating conjugated polymer nanoparticle formulations for lateral flow immunoassayscitations
- 2020High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticlescitations
- 2019Anisotropic Plasmonic CuS Nanocrystals as a Natural Electronic Material with Hyperbolic Optical Dispersioncitations
- 2017Post-polymerization C–H Borylation of Donor–Acceptor Materials Gives Highly Efficient Solid State Near-Infrared Emitters for Near-IR-OLEDs and Effective Biological Imagingcitations
- 2015One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2014One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2013Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additivescitations
- 2012Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reactioncitations
- 2012Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substratescitations
- 2011Bond strength of CFRP and steel bars in concrete at elevated temperature
- 2010Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates citations
- 2008Electrical behavior of memory devices based on fluorene-containing organic thin filmscitations
- 2004Self propagating high temperature synthesis of magnesium zinc ferrites (MgxZn1-xFe2O3): Thermal imaging and time resolved X-ray diffraction experimentscitations
Places of action
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article
Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives
Abstract
<p>In this paper, we report a comparison of interfacial reactions of Sn-3.8Ag-0.7Cu (SAC 387) and SAC (0-1.5 Zn) solder pastes on Cu (organic solderability preservative finish) and Au/Ni-P/Cu [electroless Ni immersion gold (ENIG)] substrate metallizations with Ni/Sn and Cu/Sn plated component leads. Zn added to the paste in the form of surface-coated micrometer-sized particles dissolves into the solder during reflow. High-temperature aging (150 degrees C and 185 degrees C), thermal cycling experiments (-20 degrees C to 175 degrees C for FR4 substrate, -40 degrees C to 185 degrees C for ENIG polyimide substrate), and shear testing of the solder joints were carried out. At a Cu interface, adding Zn to the solder joint improves the shear strength and suppresses Cu3Sn and overall interfacial intermetallic compound (IMC) and Kirkendall void formation <175 degrees C. However, above this temperature, the presence of Zn accelerates IMC growth. At a Ni interface, IMC suppression with Zn was noted at all temperatures. The amount of IMC suppression depends on the Zn concentration in the IMCs, which in turn depends on the geometry of joint as well as the original concentration of Zn in the solder.</p>