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| Naji, M. |
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| Azevedo, Nuno Monteiro |
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Zain, Ahmad Faizal Mohd
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Publications (5/5 displayed)
- 2016Sputter Deposition of Cuprous and Cupric Oxide Thin Films Monitored by Optical Emission Spectroscopy for Gas Sensing Applicationscitations
- 2016Correlation between Microstructure of Copper Oxide Thin Films and its Gas Sensing Performance at Room Temperaturecitations
- 2015Spectroscopic Studies of Magnetron Sputtering Plasma Discharge in Cu/O2/Ar Mixture for Copper Oxide Thin Film Fabricationcitations
- 2013Morphology, topography and thickness of copper oxide thin films deposited using magnetron sputtering techniquecitations
- 2010Characterization of Loss and Bandwidth Performance of Reflectarray Antenna Based on Lumped Componentscitations
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document
Morphology, topography and thickness of copper oxide thin films deposited using magnetron sputtering technique
Abstract
Cupric Oxide (CuO) is one of the p-type metal oxide semiconductors that are suitable for use in gas sensing device. The copper oxide thin film was prepared on silicon wafer by sputtering of pure copper target at difference deposition time of 5 min, 10 min and 15 min using RF magnetron sputtering technique. Argon flow rate, oxygen flow rate, RF power and working pressure were fixed at 50 sccm, 8 sccm, 400 W and 22.5 mTorr, respectively. The influence of the deposition time towards the surface morphology, topography and thickness has been investigated. SEM and AFM analysis showed that the grain size of the films increases with the increase of deposition time. However, the surface structure of the films remains the same. In addition, it is noticed that when the deposition time increased, the surface of the films becomes rougher. The deposition rate was approximately 29 nm/min, and it was evaluated from the film thickness deposited at several times.