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Chmela, E.
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document
Failure mechanisms of pressurized microchannels, model and experiments
Abstract
Microchannels were created by fusion bonding of a Pyrex and a thermally oxidized silicon wafer. The maximum pressure which can be applied to these channels was investigated. In order to find the relation between this maximum pressure, channel geometry, materials elasticity and bond energy an energy model was developed. It was shown that the model is substantiated by the pressure data, from which it could be calculated that the effective bond energy increased from 0.018 J/m2 to 0.19 J/m2 for an annealing temperature ranging from 3 10°C to 47OoC.