Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Delft University of Technology

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2018A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging58citations

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Daeichin, Verya
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Chen, Zhao
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2018

Co-Authors (by relevance)

  • Daeichin, Verya
  • Chen, Zhao
  • Verweij, Martin
  • Janjic, Jovana
  • Soest, Gijs Van
  • Pertijs, Michiel
  • Chen, Chao
  • Noothout, Emile
  • Jong, Nico De
  • Chang, Zu-Yao
OrganizationsLocationPeople

article

A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging

  • Daeichin, Verya
  • Chen, Zhao
  • Tan, Mingliang
  • Verweij, Martin
  • Janjic, Jovana
  • Soest, Gijs Van
  • Pertijs, Michiel
  • Chen, Chao
  • Noothout, Emile
  • Jong, Nico De
  • Chang, Zu-Yao
Abstract

<p>This paper presents an area- and power-efficient application-specified integrated circuit (ASIC) for 3-D forward-looking intravascular ultrasound imaging. The ASIC is intended to be mounted at the tip of a catheter, and has a circular active area with a diameter of 1.5 mm on the top of which a 2-D array of piezoelectric transducer elements is integrated. It requires only four micro-coaxial cables to interface 64 receive (RX) elements and 16 transmit (TX) elements with an imaging system. To do so, it routes high-voltage (HV) pulses generated by the system to selected TX elements using compact HV switch circuits, digitizes the resulting echo signal received by a selected RX element locally, and employs an energy-efficient load-modulation datalink to return the digitized echo signal to the system in a robust manner. A multi-functional command line provides the required sampling clock, configuration data, and supply voltage for the HV switches. The ASIC has been realized in a 0.18-&amp;#x03BC;m HV CMOS technology and consumes only 9.1 mW. Electrical measurements show 28-V HV switching and RX digitization with a 16-MHz bandwidth and 53-dB dynamic range. Acoustical measurements demonstrate successful pulse transmission and reception. Finally, a 3-D ultrasound image of a three-needle phantom is generated to demonstrate the imaging capability.</p>

Topics
  • impedance spectroscopy