Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (11/11 displayed)

  • 2023Electron contact interlayers for low‐temperature‐processed crystalline silicon solar cells2citations
  • 2022Gettering in silicon photovoltaics59citations
  • 2021Investigation of Gallium-Boron Spin-On Codoping for poly-Si/SiOx Passivating Contacts3citations
  • 201922.6% Efficient Solar Cells with Polysilicon Passivating Contacts on n-type Solar-Grade Wafers14citations
  • 2018Effective impurity gettering by phosphorus- and boron-diffused polysilicon passivating contacts for silicon solar cells61citations
  • 2018Impurity Gettering by Diffusion-doped Polysilicon Passivating Contacts for Silicon Solar Cells2citations
  • 2015Charge states of the reactants in the hydrogen passivation of interstitial iron in P-type crystalline silicon12citations
  • 2014External and internal gettering of interstitial iron in silicon for solar cells13citations
  • 2014The impact of SiO2/SiNrm x stack thickness on laser doping of silicon solar cell7citations
  • 2013Secondary electron microscopy dopant contrast image (SEMDCI) for laser doping16citations
  • 2012Investigating internal gettering of iron at grain boundaries in multicrystalline silicon via photoluminescence imaging30citations

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Bullock, James
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Michel, Jesus Ibarra
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Hameiri, Ziv
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Yan, Di
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Macco, Bart
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Einhaus, Roland
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Armand, Stephane
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Liang, Wensheng
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Rougieux, Fiacre E.
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Fell, Andreas
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Yang, Xinbo
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Franklin, Evan
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Xu, Lujia
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Chen, Hua
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Brink, Frank
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Walter, Daniel
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Co-Authors (by relevance)

  • Bullock, James
  • Michel, Jesus Ibarra
  • Korte, Lars
  • Hameiri, Ziv
  • Yan, Di
  • Macco, Bart
  • Berghuis, Willemjan
  • Chen, Wenhao
  • Macdonald, Daniel
  • Le, Anh Huy Tuan
  • Stuckelberger, Josua
  • Cuevas, Andres
  • Nguyen, Hieu T.
  • Young, Matthew
  • Tebyetekerwa, Mike
  • Al-Jassim, Mowafak
  • Truong, Thien N.
  • Le, Tien T.
  • Degoulange, Julien
  • Sun, Chang
  • Samundsett, Christian
  • Einhaus, Roland
  • Armand, Stephane
  • Liang, Wensheng
  • Li, Li
  • Rougieux, Fiacre E.
  • Fell, Andreas
  • Yang, Xinbo
  • Franklin, Evan
  • Xu, Lujia
  • Chen, Hua
  • Brink, Frank
  • Walter, Daniel
OrganizationsLocationPeople

article

The impact of SiO2/SiNrm x stack thickness on laser doping of silicon solar cell

  • Phang, Sieu Pheng
  • Fell, Andreas
  • Hameiri, Ziv
  • Yang, Xinbo
  • Franklin, Evan
  • Xu, Lujia
Abstract

<p>Laser doping of semiconductors has been the subject of intense research over the past decades. Previous work indicates that the use of SiO <sub>2</sub>/SiN <sub> x</sub> stacks instead of a single dielectric film as the anti-reflection coating and passivation layer results in laser doped lines with superior properties. In this paper, the impact of the SiN<sub> x</sub> layer thickness in the SiO <sub>2</sub>/SiN<sub> x</sub> stacks on the properties of laser doped lines is investigated through resistance measurements of the laser doped line and the silicon-metal contact and the doping profile near the edge of the dielectric window, the latter being an important factor in determining the likelihood of high recombination or even shunting from the subsequent metallization process. Fundamentally, a problem of exposed and undoped silicon near the dielectric window is identified for most of the investigated parameter range. However, optimization of the laser parameters and dielectric film conditions is shown to be capable of preventing or at least minimizing this problem. The results indicate that for the used laser system, samples with thick dielectric stack processed using a low pulse energy and pulse distance yield the most favorable properties, such as low line resistance and low contact resistivity. Under these conditions, the laser doped regions laterally extend underneath the dielectric films, thus reducing the likelihood of high surface recombination.</p>

Topics
  • impedance spectroscopy
  • surface
  • resistivity
  • semiconductor
  • Silicon