| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Phung, Luong Viêt
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2024Electrical characteristics and trap signatures for Schottky barrier diodes on 4H-SiC, GaN-on-GaN, AlGaN/GaN epitaxial substratescitations
- 2023Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration
- 2023Vertical pin diodes on large freestanding (100) diamond film
- 2022Design of a test package for high voltage SiC diodes
- 2016Vertical Termination Filled with Adequate Dielectric for SiC Devices in HVDC Applicationscitations
- 2013Edge Termination Design Improvements for 10 kV 4H-SiC Bipolar Diodescitations
- 2012Edge termination design improvements for 10 kV 4H-SiC bipolar diodes
Places of action
| Organizations | Location | People |
|---|
document
Design of a test package for high voltage SiC diodes
Abstract
A custom package for SiC diodes is presented. It is designed to accommodate "research-grade" devices (available in small quantities, with large variations in characteristics, and, in our case, poor topside metallisation). It allows testing of the diodes at high voltage (> 5 kV) and high current (600 A). The packaged diodes described here are used as a drop-in replacement for Si diode modules in a double-pulse setup. The packaging design is based on a "sub-package" approach, to achieve high production yield and facilitate exchange of devices failing during the tests. Packaging technologies include silver sintering for the die attach and the use of an original die topside pressing system with spring probes. Experiments validate the concept of the package.