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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Grass, Rune Sixten
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2022Micromachined integrated 2D transducers for super resolution ultrasound imaging
- 2022A Hand-Held 190+190 Row–Column Addressed CMUT Probe for Volumetric Imagingcitations
- 2020Large Scale High Voltage 192+192 Row-Column Addressed CMUTs Made with Anodic Bondingcitations
- 2019188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imagingcitations
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document
Large Scale High Voltage 192+192 Row-Column Addressed CMUTs Made with Anodic Bonding
Abstract
This work presents the fabrication process of anodically bonded 192+192 2D row-column addressed (RCA) capacitive micromachined ultrasonic transducer (CMUT) arrays. Four large 2.1 by 2.1 cm<sup>2</sup> arrays with a resonance frequency of 7.5 MHz in water and ⋋/2 element pitch at 95 µm are shown successfully fabricated. The arrays exhibit a 100% bond yield by anodically bonding an SOI wafer to a borosilicate glass wafer structured with CMUT cavities. A silicon nitride layer has been used at the wafer bonding interface to insulate the top and bottom electrodes for high voltage operation to at least ±200V DC bias. Electrical measurements have been performed on 192+192 RCA arrays and smaller 16+16 RCA arrays. These showed a resonance frequency of approximately 18 MHz in air at a bias of -200 V, corresponding to 80% of the pull-in voltage and 50 mV AC, with a coupling coefficient of 26.8 %.