| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Kruszewski, Mirosław
Warsaw University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (16/16 displayed)
- 2024Microstructure and Corrosion of Mg-Based Composites Produced from Custom-Made Powders of AZ31 and Ti6Al4V via Pulse Plasma Sinteringcitations
- 2024A comparative study of oxidation behavior of Co4Sb12 and Co4Sb10.8Se0.6Te0.6 skutterudite thermoelectric materials fabricated via fast SHS-PPS routecitations
- 2023Rapid fabrication of Se-modified skutterudites obtained via self-propagating high-temperature synthesis and pulse plasma sintering routecitations
- 2023In-depth analysis of the influence of bio-silica filler (Didymosphenia geminata frustules) on the properties of Mg matrix compositescitations
- 2022Thermoelectric properties of bismuth-doped magnesium silicide obtained by the self-propagating high-temperature synthesiscitations
- 2022Heat Treatment of NiTi Alloys Fabricated Using Laser Powder Bed Fusion (LPBF) from Elementally Blended Powderscitations
- 2022Influence of Ag particle shape on mechanical and thermal properties of TIM jointscitations
- 2022A comparison of the microstructure-dependent corrosion of dual-structured Mg-Li alloys fabricated by powder consolidation methods: Laser powder bed fusion vs pulse plasma sinteringcitations
- 2022Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particlescitations
- 2021Microstructure and Thermoelectric Properties of Doped FeSi2 with Addition of B4C Nanoparticlescitations
- 2020Thermoelectric properties of Cu2S obtained by high temperature synthesis and sintered by IHP methodcitations
- 2019Microstructure and thermoelectric properties of p and n type doped β-FeSi2 fabricated by mechanical alloying and pulse plasma sinteringcitations
- 2018Skutterudite (CoSb3) thermoelectric nanomaterials fabricated by Pulse Plasma in Liquidcitations
- 2017Design of interfacial Cr 3 C 2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applicationscitations
- 2014Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additivecitations
- 2011W/steel joint fabrication using the pulse plasma sintering (PPS) methodcitations
Places of action
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document
Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles
Abstract
The aim of this work is to develop and investigate bare Si chips assembly to Au plated substrates. In this research thermal interface material paste based on mixture of micro-Ag particles and pressureless sintering at 175 °C was studied. Joints obtained in the experiments had adhesion of 10 MPa and thermal resistance as low as 0.25 K/W. Novelty of this work is application of micro-Ag paste at low temperature process and without pressure applied on the chip. Those parameters are usually shown as limitation of Ag paste applications. Additionally, after ageing for 500 h at 125°C and thermal cycles (-20°C ÷ 100°C) investigated joints maintained their mechanical and thermal properties.