| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Yin, Ran
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2023Characterization of Embedded and Thinned RF Chipscitations
- 2022Characterization of material adhesion in redistribution multilayer for embedded high-frequency packagescitations
- 2022Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterizationcitations
- 2022Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chipscitations
Places of action
| Organizations | Location | People |
|---|
document
Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips
Abstract
<p>Drivers for 3D packaging solutions are increasing constantly. This work investigated a new interconnect technique using sheet molding process to enable Package-on-Package (PoP) stacking. This technique is based on sheet molding compound (SMC), which is suitable for multi-layer structures, thin and large area packaging. With the assist of vacuum, multiple singulated thinned Cu-pillar chips could be embedded in the sheet mold, to enable panel-level-packaging or wafer-level packaging following the mold-first approach. In this work, the feasibility of replacing the conventional epoxy-based molding compound (EMC) by SMC is investigated by experiments on different Cu-pillar standoffs and pitches. Furthermore, shear test of Cu buttons 200{{ m}} in diameter and 40{ m} in height is carried out to determine the adhesion of the deposited layer on the SMC surface. </p>