| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Li, Feng
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2023Effect of degree of substitution on the microphase separation and mechanical properties of cellooligosaccharide acetate-based elastomerscitations
- 2022Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effectscitations
- 2022Singlet and triplet to doublet energy transfer: improving organic light-emitting diodes with radicals
- 2022Amino acids as activators for wave solder flux systems: Investigation of solderability and humidity effectscitations
- 2022Singlet and triplet to doublet energy transfer: improving organic light-emitting diodes with radicals.
- 2021Alkanolamines as activators in no-clean flux systems: investigation of humidity robustness and solderabilitycitations
- 2020Humidity Robustness of Plasma-Coated PCBscitations
- 2020Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliabilitycitations
- 2020Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloyscitations
- 2018On the ductility of alpha titanium: The effect of temperature and deformation modecitations
- 2018On the ductility of alpha titanium: The effect of temperature and deformation modecitations
- 2018Corrosion Reliability of Lead-Free Solder Systems Used in Electronicscitations
- 2017Lubrication of aluminium versus diamond-like carbon contacts with hydrophobin proteinscitations
- 2017Corrosion reliability of lead-free solder systems used in electronicscitations
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document
Corrosion reliability of lead-free solder systems used in electronics
Abstract
The present work investigated the corrosion reliability of Sn-Ag-Cu based five lead-free solder alloys. The corrosion and electrochemical migration (ECM) susceptibility study of the solder alloys has been carried out by water droplet (WD) tests on pure alloy ingot samples, and by accelerated humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods. The galvanic corrosion was found between cathodically active Bi phase and anodic (Sn, Sb) solid solution in InnoLot alloy, while the Ag3Sn phase was cathodically active in the other four alloys. The paper theoretically illustrated the reason for the differences in corrosion reliability in the five alloys based on the composition and distribution of intermetallic compounds (IMCs).