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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Jones, Thomas David Arthur
University of Dundee
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024Demonstration of a high-performance continuous casting process for cobalt alloy ASTM F75
- 2022Inkjet printing of high-concentration particle-free platinum inkscitations
- 2021Phase Field & Monte Carlo Potts Simulation of Grain Growth and Morphology of Vertically Upwards Cast Oxygen Free Copper
- 2021Optimising Computational Fluid Dynamic Conditions for Simulating Copper Vertical Castingcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2017Enhanced electrodeposition for the filling of micro-vias
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
Places of action
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document
Hybrid Additive Manufacture of Conformal Antennas
Abstract
This paper presents a new digitally driven manufacturing process chain for the production of high performance, three-dimensional RF devices. This is achieved by combining Fused Filament Fabrication of polyetherimide based polymer with selective light-based synthesis of silver nanoparticles and electrochemical deposition of copper. The resultant manufacturing method produces devices with excellent DC electrical resistivity (6.68 μΩ cm) and dielectric properties (relative permittivity of 2.67 and loss tangent of 0.001). Chemically modifying and patterning the substrate to produce the metallization overcomes many of the limitations of direct write deposition methods resulting in improved performance, adhesion and resolution of the antenna pattern. The fabricated demonstrators cover a broadband range of 0.1 GHz - 10 GHz and the measured results show a direct agreement with the simulated design over a wide frequency band. Overall the materials used as a substrate have a low relative permittivity and lower dielectric loss than FR-4, thereby making them well suited for antenna applications.