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Dinelli, Franco
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Publications (10/10 displayed)
- 2024Magnetic Behaviour of Iron Oxide/Dextran Nanoparticles in a Keratin Matrix
- 2023Role of oxygen vacancies in the structural phase transformations of granular TiO2 thin filmscitations
- 2020Poly(N-isopropylacrylamide) based thin microgel films for use in cell culture applicationscitations
- 2017Subsurface imaging of two-dimensional materials at the nanoscalecitations
- 2015Nanoscale rippling on polymer surfaces induced by AFM manipulationcitations
- 2015Surface rippling induced by periodic instabilities on a polymer surfacecitations
- 2015Nanometre scale 3D nanomechanical imaging of semiconductor structures from few nm to sub-micrometre depthscitations
- 2015Nanometre scale 3D nanomechanical imaging of semiconductor structures from few nm to sub-micrometre depthscitations
- 2014How Deep Ultrasonic and Heterodyne Force Microscopies Can Look at the Nanostructure of 2D Materials?
- 2005Correlation Between Morphology and Field-Effect-Transistor Mobility in Tetracene Thin Filmscitations
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document
Nanometre scale 3D nanomechanical imaging of semiconductor structures from few nm to sub-micrometre depths
Abstract
Multilayer structures of active semiconductor devices (1), novel memories (2) and semiconductor interconnects are becoming increasingly three-dimensional (3D) with simultaneous decrease of dimensions down to the few nanometres length scale (3). Ability to test and explore these 3D nanostructures with nanoscale resolution is vital for the optimization of their operation and improving manufacturing processes of new semiconductor devices. While electron and scanning probe microscopes (SPMs) can provide necessary lateral resolution, their ability to probe underneath the immediate surface is severely limited. Cross-sectioning of the structures via focused ion beam (FIB) to expose the subsurface areas often introduces multiple artefacts that mask the true features of the hidden structures, negating benefits of such approach. In addition, the few tens of micrometre dimension of FIB cut, make it unusable for the SPM investigation.