Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2018The influence of the molecular architecture on the thermal and the dielectric properties of epoxy resin networks9citations

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Andritsch, Thomas
1 / 70 shared
Saeedi, Istebreq A.
1 / 8 shared
Vaughan, Alun S.
1 / 70 shared
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2018

Co-Authors (by relevance)

  • Andritsch, Thomas
  • Saeedi, Istebreq A.
  • Vaughan, Alun S.
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document

The influence of the molecular architecture on the thermal and the dielectric properties of epoxy resin networks

  • Andritsch, Thomas
  • Salter, Daniel J.
  • Saeedi, Istebreq A.
  • Vaughan, Alun S.
Abstract

<p>Epoxy resins are used as the base insulating material in many electrical applications, including cast resin transformers, bushings and cable terminations. The performance of the resin-based insulation governs the efficiency of these applications. To understand the factors that determine the different properties of epoxy resin insulating materials, in this work, we studied the thermal and electrical properties of amine and anhydride cured epoxy resin systems. The glass transition temperature Tg, permittivity and breakdown strength of three resin systems were investigated. The results of differential scanning calorimetry indicated that the Tg of the tested system is related to the free volume in the system, which is affected by the degree of cross linking. The extent of reactions between the resin and the hardener (or the crosslinking) is ascribed to the reaction mechanisms between the active group of the hardener and the epoxide groups of the resin. Dielectric spectroscopy revealed a standard beta relaxation in the imaginary permittivity of all systems. The strength of the beta relaxation is related to the formation of hydroxyl groups and the local structure around the crosslinking which may constrain the movement of the -OH groups. This research provides insights concerning the relations between the curing mechanisms and the thermal and electrical properties; this, consequently, represents a potential mean of tailoring the overall performance of epoxy resin systems to suit particular applications.</p>

Topics
  • impedance spectroscopy
  • glass
  • glass
  • strength
  • thermogravimetry
  • glass transition temperature
  • differential scanning calorimetry
  • resin
  • amine
  • curing