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Li, Yifan
Northumbria University
in Cooperation with on an Cooperation-Score of 37%
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Publications (7/7 displayed)
- 2023Fatigue of octet-truss lattices manufactured by Laser Powder Bed Fusioncitations
- 2021Compressive fatigue characteristics of octet-truss lattices in different orientationscitations
- 2021Metal‐textile laser welding for wearable sensors applicationscitations
- 2020Laser-engraved textiles for engineering capillary flow and application in microfluidicscitations
- 2019Fatigue of thin periodic triangular lattice platescitations
- 2013Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresistcitations
- 2010Recent developments on ZnO films for acoustic wave based bio-sensing and microfluidic applications: a reviewcitations
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document
Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresist
Abstract
An improved bottom-up electroplating technique has been successfully developed for the fabrication of TSV arrays with 9.5:1 aspect ratios. 125,500 TSVs have been fabricated in an area of 6×6 cm with a horizontal and vertical pitch of 240 μm. A method of visually inspecting the via yield is presented, and Kelvin test structures and contact chain test structures have been fabricated to electrically evaluate single and multiple TSVs respectively. The average resistance of the Cu vias was measured as of 9.1 mΩ using the Kelvin contact resistance structures.