| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Tian, Yingtao
Lancaster University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2019Effect of processing parameters on the densification, microstructure and crystallographic texture during the laser powder bed fusion of pure tungstencitations
- 2016Laser polishing - Enhancing surface quality of additively manufactured cobalt chrome and titanium components
- 2016Process Optimization of Dual-Laser Beam Welding of Advanced Al-Li Alloys Through Hot Cracking Susceptibility Modelingcitations
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2009Megasonic agitation for enhanced electrodeposition of coppercitations
- 2009Megasonic agitation for enhanced electrodeposition of coppercitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2008Megasonic enhanced wafer bumping process to enable high density electronics interconnectioncitations
Places of action
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document
Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation
Abstract
Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.