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Patel, Mayur
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Publications (5/5 displayed)
- 2022Thin Film Solution Processable Perovskite Solar Cellcitations
- 2013Numerical modeling of the electroplating process for microvia fabricationcitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streamingcitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streamingcitations
- 2012Parametric modeling study of basic electrodeposition in microviascitations
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document
Numerical modeling of the electroplating process for microvia fabrication
Abstract
For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.