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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Fuchs, Peter Filipp
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2024MetamaterialFindercitations
- 2022Asymmetric chiral and antichiral mechanical metamaterials with tunable Poisson's ratiocitations
- 2020Tailored Interfaces in Fiber-Reinforced Elastomerscitations
- 2020Influence of Fiber Orientation and Adhesion Properties On Tailored Fiber-reinforced Elastomerscitations
- 2020Viscoelastic Behavior of Glass-Fiber-Reinforced Silicone Composites Exposed to Cyclic Loadingcitations
- 2020The Tension-Twist Coupling Mechanism in Flexible Compositescitations
- 2018Influence of environmental factors like temperature and humidity on MEMS packaging materials.citations
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document
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Abstract
<p>Microelectromechanical systems (MEMS) and MEMS packaging solutions are gaining increased interests for electronic applications. These packages feature a variety of polymeric materials and composites e.g. fiber reinforced polymer laminates, insulating and conductive adhesives. Due to the sensitivity of MEMS devices to mechanical stress and environmental factors such as temperature and humidity, the influence of these factors on the device's performance needs to be accounted for. In this contribution, a fabric woven glass fiber reinforced epoxy resin (BT epoxy resin) and two chosen adhesives commonly used in semiconductor and MEMS packaging have been considered and their dependency on environmental parameters have been studied with different testing methods. Based on the measured material properties a simulation process predicting the package under defined environmental loads is presented.</p>