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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Feuchter, Michael
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Morphological structure and mechanical properties of a nucleated Polyoxymethylene (POM) homopolymer resin processed under conventional injection molding conditions
- 2024Impact Characteristics and Repair Approaches of Distinct Bio-Based Matrix Composites: A Comparative Analysiscitations
- 2024Effect of different weft-knitted structures on the mechanical performance of bio-based flexible compositescitations
- 2024Manufacturing bio-based fiber-reinforced polymer composites: Process performance in RTM and VARI processescitations
- 2023Impact of Multiple Reprocessing on Properties of Polyhydroxybutyrate and Polypropylenecitations
- 2023Tensile properties of flexible composites with knitted reinforcements from various yarn materialscitations
- 2023Investigation of the Mechanical Properties of Sandwich Composite Panels Made with Recyclates and Flax Fiber/Bio-Based Epoxy Processed by Liquid Composite Moldingcitations
- 2022Dynamic mechanical response in epoxy nanocomposites incorporating various nano-silica architectures
- 2022Towards virtually optimized curing cycles for polymeric encapsulations in microelectronicscitations
- 2022Injection Molding Simulation of Polyoxymethylene Using Crystallization Kinetics Data and Comparison with the Experimental Processcitations
- 2021Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
- 2021Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronicscitations
- 2020Exploiting the Carbon and Oxa Michael Addition Reaction for the Synthesis of Yne Monomerscitations
- 2018Influence of environmental factors like temperature and humidity on MEMS packaging materials.citations
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document
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Abstract
<p>Microelectromechanical systems (MEMS) and MEMS packaging solutions are gaining increased interests for electronic applications. These packages feature a variety of polymeric materials and composites e.g. fiber reinforced polymer laminates, insulating and conductive adhesives. Due to the sensitivity of MEMS devices to mechanical stress and environmental factors such as temperature and humidity, the influence of these factors on the device's performance needs to be accounted for. In this contribution, a fabric woven glass fiber reinforced epoxy resin (BT epoxy resin) and two chosen adhesives commonly used in semiconductor and MEMS packaging have been considered and their dependency on environmental parameters have been studied with different testing methods. Based on the measured material properties a simulation process predicting the package under defined environmental loads is presented.</p>