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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Mueller, Maik
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2024Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
- 2023Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modelingcitations
- 2022Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solutioncitations
- 2020Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testingcitations
- 2020Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Ballscitations
- 2018Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Ballscitations
- 2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integrationcitations
- 2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffractioncitations
- 2012Effects of bonding pressure on quality of SLID interconnectscitations
- 2011Solidification processes in the Sn-rich part of the SnCu systemcitations
- 2010Microstructure Characterization Of Lead‐Free Solders Depending On Alloy Compositioncitations
- 2010Metallographic preparation of the SnAgCu solders for optical microscopy and EBSD Investigationscitations
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document
Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Balls
Abstract
This study focuses on the morphologies of primary Cu6Sn5 intermetallics in small free standing SnCu (Ø 270 μm) solder balls. Those showed a large variety of different shapes and sizes ranging from facetted hexagonal rods, to partly facetted splitting crystals and parallel growing branches, to dendritic crystals without facets. The results of electron backscatter diffraction (EBSD) measurements confirm [0001] as the major growth direction and the {10I0} planes as facets of the hexagonal rods. The formation of splitting crystals parallel to the {10I0} planes may be caused by a slight deviation of the major growth direction towards <;2II0>. Morphology transition to dendritic structures can be influenced primarily by increasing the Cu content of the alloy and the cooling rate. However, strong variations occur even if the composition and the cooling rate are constant. Differences in undercooling of the Cu6Sn5 phase have been discussed as a possible reason, since a decreasing solidification temperature promotes a faster initial phase growth due to the increasing oversaturation of the melt's Cu content.