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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Domann, G.
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- 2020Screen-Printed Ferroelectric P(VDF-TrFE)- co-PbTiO3and P(VDF-TrFE)- co-NaBiTi2O6Nanocomposites for Selective Temperature and Pressure Sensingcitations
- 2011Nanoimprinted complementary organic electronics: Single transistors and inverterscitations
- 2010Rapid prototyping of electronic modules combining aerosol printing and ink jet printingcitations
- 2008Concepts to control the relative permittivity (er) of nanoscaled inorganic-organic hybrid polymers for various applications in microelectronics
- 2006Preventing of dewetting effects for inorganic-organic hybrid polymers applied in sequentially buildup (SBU) technology without surface pretreatmentscitations
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document
Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Abstract
<p>Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet® printing and ink jet printing. Conductive silver traces own to 20 μm width were printed together with large mterconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER®) and on glass substrates. New copper nickel inks and high-k ORMOCER®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.</p>