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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Wu, Qiang
Northumbria University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Surface and bulk ferroelectric phase transition in super-tetragonal BiFeO 3 thin filmscitations
- 2021Low-energy electron control over physical and chemical properties of organic aromatic thin layers at the micrometre scale
- 2020Integrating radio-over-fiber communication system and BOTDR sensor systemcitations
- 2018A comprehensive experimental study of whispering gallery modes in a cylindrical microresonator excited by a tilted fiber tapercitations
- 2017Strain-induced spectral tuning of the whispering gallery modes in a cylindrical micro-resonator formed by a polymer optical fibercitations
- 2012Chalcogenide microsphere fabricated from fiber tapers using contact with a high-temperature ceramic surfacecitations
- 2011Lead silicate glass microsphere resonators with absorption-limited Qcitations
- 2008Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beamcitations
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document
Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam
Abstract
In this paper we investigate and compare a laser-driven joining process with two different illumination conditions: (i) high speed scanning of a focused beam and (ii) reasonably uniform ldquoflood illuminationrdquo of the whole sample. It is shown that the scanning beam not only avoids illuminating the central part of the device, but also provides more uniform heating of the area to be bonded than laser ldquoflood illuminationrdquo. We demonstrate bonding of three different packages: (i) LCC (Leadless chip carrier) packages, (ii) AlN and (iii) LTCC (Low temperature co-fired ceramic) substrates to ldquotop-hatrdquo packages, using a scanned beam from a fibre-delivered high power laser diode array to cure an intermediate layer of glass frit. Standard leak testing demonstrates that all those samples have excellent hermetic sealing with leak rates at the level of 10-9 atmldrcc/s.