| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Amalu, Dr Emeka
Teesside University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2024Mineral wastescitations
- 2024Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Packagecitations
- 2024Critical methods of geopolymer feedstocks activation for suitable industrial applicationscitations
- 2024Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliabilitycitations
- 2023Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packagingcitations
- 2023Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistorscitations
- 2021Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositionscitations
- 2020Comparing and benchmarking fatigue behaviours of various SAC solders under thermo-mechanical loadingcitations
- 2019Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageingcitations
- 20193D printing of intricate sand cores for complex copper castings
- 2018Effect of Temperature on Conductivity of PLA-Carbon 3D Printed Components.
- 2016Effects of component stand-off height on reliability of solder joints in assembled electronic component
- 2015Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assembly
- 2015A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assemblycitations
- 2012High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off heightcitations
- 2012High temperature reliability of lead-free solder joints in a flip chip assemblycitations
- 2012Thermal management materials for electronic control unitcitations
- 2012Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operationscitations
- 2011Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module
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document
Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing
Abstract
Solder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system’s operation often culminates in<br/>catastrophic failure of the device. The determination of creep damage in electronic component solder joint is vital to the prediction of crack initiation and prevention of premature failure. This paper presents the creep damage in solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB) and subjected to thermal cycling as well as isothermal ageing. ANSYS 19.0 package<br/>is employed to model the isothermal ageing at -40, 25, 75 and 150℃ temperatures for 45 days. Standard temperature cycle profile is used to simulate the effect of the coefficient of thermal expansion (CTE) mismatch on the bonded materials in the BGA component. The solders studied are lead-based eutectic solder alloy and lead-free SAC396, SAC387, and SAC305. Based on the results obtained for the stress, strain rate, deformation rate and strain energy of the solders, the research investigation advises on the most effective solder for achieving improvement in the thermo-mechanical reliability of solder joints in BGA soldered on PCB.