| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Bock, Karlheinz
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (43/43 displayed)
- 2024Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
- 2024Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Linkcitations
- 2023Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEAcitations
- 2023Electro-optical co-integration platform for high-density hybrid systems - SILHOUETTE
- 2023Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Linkcitations
- 2023Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Linecitations
- 2023Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modelingcitations
- 2023Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfillcitations
- 2023Characterization of Embedded and Thinned RF Chipscitations
- 2023Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modelingcitations
- 2023Feasibility and Optimisation of Cu-Sintering under Nitrogen Atmospherecitations
- 2022Characterization of material adhesion in redistribution multilayer for embedded high-frequency packagescitations
- 2022Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterizationcitations
- 2022Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chipscitations
- 2022Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature Application
- 2020Stereolithographic printed polymers on ceramic for 3D-opto-MIDcitations
- 2020Influence of flexibility of the interconnects on the dynamic bending reliability of flexible hybrid electronicscitations
- 2019Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devicescitations
- 2019Analysis of flip-chip solder joints under isothermal vibration loadingcitations
- 2018Interconnect Technology Development for 180GHz Wireless mm-Wave System-in-Foil Transceiverscitations
- 2018The future of short-range high-speed data transmissioncitations
- 2018Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?citations
- 2018Roll-to-roll processing of film substrates for hybrid integrated flexible electronicscitations
- 2018Wire Bonding of Surface Acoustic Wave (SAW) Sensors for High Temperature Applicationscitations
- 2018Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Applicationcitations
- 2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assemblycitations
- 2016A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils
- 2016Screen printed conductive pastes for biomedical electronicscitations
- 2015Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substratescitations
- 2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applicationscitations
- 2014Investigations of the fracture strength of thin silicon dies embedded in flexible foil substratescitations
- 2014Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tagscitations
- 2013"Sensor-filter" - intelligent micro filter system in foil technology
- 2013Genotyping of single nucleotide polymorphisms by melting curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil systemcitations
- 2013Foil-based DNA melting curve analysis platform for low-cost point-of-care molecular diagnostics
- 2012"Sensor-filter" - intelligent micro filter system in foil technology
- 2012DNA melting curve analysis on semi-transparent thin film microheater on flexible lab-on-foil substrate
- 2011Ultra-thin wafer fabrication through dicing-by-thinningcitations
- 2011Influence of wafer grinding and etching techniques on the fracture strength of thin silicon substratescitations
- 2010Rapid prototyping of electronic modules combining aerosol printing and ink jet printingcitations
- 2010Electrical stress on film resistive structures on flexible substratescitations
- 2009Properties of conductive microstructures containing nano sized silver particlescitations
- 2008Selective one-step plasma patterning process for fluidic self-assembly of silicon chipscitations
Places of action
| Organizations | Location | People |
|---|
conferencepaper
Analysis of flip-chip solder joints under isothermal vibration loading
Abstract
S.138-142 ; This work focuses on the reliability needs which are caused by the use of recent package solutions for harsh environmental use cases such as assisted or autonomous driving. Simultaneous thermal and mechanical loading of highly integrated packages as Flip-Chip (FC) packages has to be considered, investigated and understood. An earlier introduced test approach used to investigate CR0805 solder joints under combined loading was modified to enable the analysis of FC solder joints. Thus, investigations of solder joint geometries of FC, CSP and BGA packages are now possible. In this work, results on the fatigue behaviour of SnAgCu FC solder joints will be shown. The experiments were conducted under varied harmonic vibration amplitudes at room temperature. A 4.6 x 2.6 mm 2 bare die FC package with a 5 x 5 interconnection grid was tested. Bump size, pad diameter and stand-off are 370 mm, 330 mm and 280 mm , respectively. The damage and fatigue behaviour of the FC solder joints was examined using cross sections. First, test results show damage of solder joints stressed with a peak-to-peak deflection of 1.6 mm for up to 75 Million cycles at room temperature. The damage occurred within the solder volume in very close proximity to or at the substrate pad intermetallic interface. Further tests considering varied stress levels are ongoing.