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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Tian, Yingtao
Lancaster University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2019Effect of processing parameters on the densification, microstructure and crystallographic texture during the laser powder bed fusion of pure tungstencitations
- 2016Laser polishing - Enhancing surface quality of additively manufactured cobalt chrome and titanium components
- 2016Process Optimization of Dual-Laser Beam Welding of Advanced Al-Li Alloys Through Hot Cracking Susceptibility Modelingcitations
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2009Megasonic agitation for enhanced electrodeposition of coppercitations
- 2009Megasonic agitation for enhanced electrodeposition of coppercitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2008Megasonic enhanced wafer bumping process to enable high density electronics interconnectioncitations
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document
High density indium bumping using electrodeposition enhanced by megasonic agitation
Abstract
<p>Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 µm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study. ©2009 IEEE.</p>