| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Flynn, David
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Role of interface in optimisation of polyamide-6/Fe3O4 nanocomposite properties suitable for induction heating.citations
- 2023Role of interface in optimisation of polyamide-6/Fe3O4 nanocomposite properties suitable for induction heatingcitations
- 2022Quantification of wear in glass reinforced epoxy resin composites using surface profilometry and assessing effect of surfacing film involvementcitations
- 2021A Review of Sensing Technologies for Non-Destructive Evaluation of Structural Composite Materialscitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2018Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Rangecitations
- 2018Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radarcitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A digitally-driven Hybrid Manufacturing process for the flexible production of engineering ceramic components
- 2017Analysis of geomaterials using frequency-modulated continuous wave radar in the K-band
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
- 2014Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuningcitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streamingcitations
- 2013Microstructure formation in a thick polymer by electrostatic-induced lithographycitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streamingcitations
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2011Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
- 2011Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications
- 2010Influence of pulse reverse plating on the properties of Ni-Fe thin filmscitations
- 2010Bespoke interconnect technologies for optoelectronic and biomedical products
- 2009Design, fabrication, and characterization of flip-chip bonded microinductorscitations
- 2009Design methodology and fabrication process of a microinductor for the next generation of DC-DC power converterscitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2006Assessment of microinductors for DC-DC converters
Places of action
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document
High density indium bumping using electrodeposition enhanced by megasonic agitation
Abstract
<p>Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 µm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study. ©2009 IEEE.</p>