| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Lahti, Markku
VTT Technical Research Centre of Finland
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2024Cryogenic characterization of LTCC material in Millimeter-Wave Frequenciescitations
- 2018Reliability assessment and failure mode analysis of MEMS accelerometers for space applicationscitations
- 2012Hot laminated multilayer polymer illumination structure based in embedded LED chipscitations
- 2011Investigation of substrate integrated waveguide in LTCC technology for mm-wave applications
- 2011System-in-package LTCC platform for 3D RF to millimeter wavecitations
- 2010Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology
- 2007Mixed LTCC ultra compact S-band filters with wide multispurious stopbandcitations
- 2006Integrated LTCC modules by laminating and co-firing tapes directly on heat sinkcitations
Places of action
| Organizations | Location | People |
|---|
document
Integrated LTCC modules by laminating and co-firing tapes directly on heat sink
Abstract
A novel method to laminate and co-fire LTCC tapes directly on a heatsink was studied. Several tape systems, including combination of mixedpermittivities, and heat sink material options have been demonstrated. Thecritical issue in the selection of materials was the compatibility of CTEvalues between different materials due to wide temperature range in theprocessing. The most optimal heat sink material was AlN. It has high thermalconductivity and good enough CTE match to LTCC tapes used. In addition, it canbe selectively patterned. The effects of LTCC processing on electrical valueswere studied by utilizing buried capacitors and transmission lines.